Takahashi, Yoshikazu

Fuji Electric (Japan)

1 paper on CoChatORCID 0009-0005-2435-5142

Most cited papers

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Direct liquid cooling module with high reliability solder joining technology for automotive applications
Morozumi, A., Hokazono, H., Nishimura, Y., Ikeda, Y., Nabetani, Y., & Takahashi, Y. (2013) · 2013 25th International Symposium on Power Semiconductor Devices & IC's (ISPSD)
Electronic Packaging and Soldering TechnologiesSilicon Carbide Semiconductor Technologies
Cited by 38

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