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Cited by 210

The DOI matches its Crossref record; 1 of the 1 references it cites were found in a registry or an index.

Direct‐Write Assembly of Three‐Dimensional Photonic Crystals: Conversion of Polymer Scaffolds to Silicon Hollow‐Woodpile Structures

Gratson, G. M., García‐Santamaría, F., Lousse, V., Xu, M., Fan, S., Lewis, J. A., Braun, P. V.·2006·Advanced Materials

Abstract

3D Si hollow-woodpile photonic crystals are formed through the direct-write assembly of concentrated polyelectrolyte inks (rods ∼1 μm in diameter) followed by a sequential silica/silicon chemical vapor deposition process (see Figure). The direct conversion of 3D polymer microstructures to materials like silicon may enable such applications as photonic materials, low-cost microelectromechanical systems (MEMS), microfluidic networks for heat dissipation, and biological devices.

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Metadata

Authors
Gratson, G. M., García‐Santamaría, F., Lousse, V., Xu, M., Fan, S., Lewis, J. A., & Braun, P. V.
Venue
Advanced Materials
Publisher
Wiley
Published
2006-01-24
Volume
18
Issue
4
Pages
461-465
ISSN
  • 0935-9648 (ISSN-L)
  • 1521-4095
OpenAlex
W2155125185
Cited by
210
References
1
FWCI
10.52
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: Direct‐Write Assembly of Three‐Dimensional Photonic Crystals: Conversion of Polymer Scaffolds to Silicon Hollow‐Woodpile Structures. https://app.cochat.ai/papers/10.1002/adma.200501447
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Gratson, G. M., García‐Santamaría, F., Lousse, V., Xu, M., Fan, S., Lewis, J. A., & Braun, P. V. (2006). Direct‐Write Assembly of Three‐Dimensional Photonic Crystals: Conversion of Polymer Scaffolds to Silicon Hollow‐Woodpile Structures. Advanced Materials. https://doi.org/10.1002/adma.200501447

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