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Cited by 312

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Dense Self‐Assembly on Sparse Chemical Patterns: Rectifying and Multiplying Lithographic Patterns Using Block Copolymers

Cheng, Joy Y., Rettner, Charles T., Sanders, Daniel P., Kim, Ho‐Cheol, Hinsberg, William D.·2008·Advanced Materials

Abstract

A lithography-friendly self-assembly process which multiplies and rectifies an existing resist patterns is demonstrated here. A polymer film (right figure) has assembled at a 14 nm half-pitch on a thin resist pattern at twice the period (left figure). This directed self-assembly process dramatically heals defects and reduces feature size variation of the ill-defined resist patterns.

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Metadata

Authors
Cheng, J. Y., Rettner, C. T., Sanders, D. P., Kim, H., & Hinsberg, W. D.
Venue
Advanced Materials
Publisher
Wiley
Published
2008-08-14
Volume
20
Issue
16
Pages
3155-3158
ISSN
  • 0935-9648 (ISSN-L)
  • 1521-4095
OpenAlex
W2074791001
Cited by
312
References
0
FWCI
15.16
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: Dense Self‐Assembly on Sparse Chemical Patterns: Rectifying and Multiplying Lithographic Patterns Using Block Copolymers. https://app.cochat.ai/papers/10.1002/adma.200800826
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Cheng, J. Y., Rettner, C. T., Sanders, D. P., Kim, H., & Hinsberg, W. D. (2008). Dense Self‐Assembly on Sparse Chemical Patterns: Rectifying and Multiplying Lithographic Patterns Using Block Copolymers. Advanced Materials. https://doi.org/10.1002/adma.200800826

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Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.