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Cited by 238

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High‐Density Soft‐Matter Electronics with Micron‐Scale Line Width

Gozen, B. Arda, Tabatabai, Arya, Ozdoganlar, O. Burak, Majidi, Carmel·2014·Advanced Materials

Abstract

A method to produce soft and stretchable microelectronics composed of a liquid-phase Gallium-Indium alloy with micron-scale circuit features is introduced. Microchannels are molded onto the surface of a poly(dimethylsiloxane) (PDMS) elastomer and filled with EGaIn using a micro-transfer deposition step that exploits the unique wetting properties of EGaIn in air. The liquid-filled channels function as stretchable circuit wires or capacitor electrodes with a 2 μm linewidth and 1 μm spacing.

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Metadata

Authors
Gozen, B. A., Tabatabai, A., Ozdoganlar, O. B., & Majidi, C.
Venue
Advanced Materials
Publisher
Wiley
Published
2014-06-05
Volume
26
Issue
30
Pages
5211-5216
ISSN
  • 0935-9648 (ISSN-L)
  • 1521-4095
OpenAlex
W2147817403
Cited by
238
References
0
FWCI
9.02
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: High‐Density Soft‐Matter Electronics with Micron‐Scale Line Width. https://app.cochat.ai/papers/10.1002/adma.201400502
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Gozen, B. A., Tabatabai, A., Ozdoganlar, O. B., & Majidi, C. (2014). High‐Density Soft‐Matter Electronics with Micron‐Scale Line Width. Advanced Materials. https://doi.org/10.1002/adma.201400502

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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.