The DOI matches its Crossref record; 12 of the 13 references it cites were found in a registry or an index.
Pulsed laser ablation in a cooled liquid environment
Overview
Integrity signals
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Verification
Claims the paper makes
Claims other papers make about this one
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In the citing paper
“Furthermore, the ablation rate decreased as the temperature was increased because of the formation of Si(OH)x debris, which blocked the laser from further ablation.”
Citations
Cites
Laser Processing and Chemistry
Bäuerle, D. (1996) · Springer eBooks · doi:10.1007/978-3-662-03253-4 · Cited by 2,199
Seidel, H., Csepregi, L., Heuberger, A., & Baumgärtel, H. (1990) · Journal of The Electrochemical Society · doi:10.1149/1.2086277 · Cited by 1,633
Laser ablation of solid substrates in water and ambient air
Zhu, S., Lu, Y. F., Hong, M. H., & Chen, X. Y. (2001) · Journal of Applied Physics · doi:10.1063/1.1342200 · Cited by 193
Self-citationLaser Ablation: Principles and Applications
Miller, J. C. (2011) · Springer series in materials science · doi:10.1007/978-3-642-78720-1 · Cited by 137
Laser ablation of solid substrates in a water-confined environment
Zhu, S., Lu, Y., & Hong, M. (2001) · Applied Physics Letters · doi:10.1063/1.1400086 · Cited by 127
Self-citationSubsurface heating effects during pulsed laser evaporation of materials
Singh, R. K., Bhattacharya, D., & Narayan, J. (1990) · Applied Physics Letters · doi:10.1063/1.104118 · Cited by 121
Chen, G. X., Hong, M., Chong, T. C., Elim, H. I., Ma, G., & Ji, W. (2004) · Journal of Applied Physics · doi:10.1063/1.1637933 · Cited by 112
Self-citationChemical mechanical polishing in silicon processing
Li, S. H., & Miller, R. O. (2000) · Cited by 69
Advanced materials processing based on interaction of laser beam and a medium
Sugioka, K., Obata, K., Midorikawa, K., Hong, M., Wu, D. J., Wong, L. L., Lu, Y., & Chong, T. C. (2003) · Journal of Photochemistry and Photobiology A Chemistry · doi:10.1016/s1010-6030(03)00031-5 · Cited by 30
Self-citationSi etching affected by ir laser irradiation
Bunkin, F. V., Luk’yanchuk, B., Шафеев, Г. А., Kozlova, E. K., Portnyagin, A. I., Yeryomenko, A. A., Mogyorósi, P., & Kiss, J. G. (1985) · Applied Physics A · doi:10.1007/bf00618861 · Cited by 15
Research works printed but not linked: 3
- A. Held, M. Li, Meeting industry needs with laser micromachining. Solid State Technol. 46(10), 83–90 (2003)
- M. Reiche, G. Wagner, Wafer thinning: techniques for ultra-thin wafers. Adv. Packag. 12(3), 29 (2003)
- E. Gaulhofer, H. Oyrer, Wafer thinning and strength enhancement to meet emerging packaging requirements, in IEMT Europe 2000 Symposium, Semicon, Munich, Germany, April, 2000
Cited by
Laser precision engineering: from microfabrication to nanoprocessing
Chong, T. C., Hong, M. H., & Shi, L. (2009) · Laser & Photonics Review · doi:10.1002/lpor.200810057 · Cited by 224
Self-citationManshina, A., Tumkin, I. I., Khairullina, E. M., Mizoshiri, M., Ostendorf, A., Kulinich, S. A., Makarov, S., Kuchmizhak, A. A., & Gurevich, E. L. (2024) · Advanced Functional Materials · doi:10.1002/adfm.202405457 · Cited by 114
Subhan, A., Mourad, A.-H. I., & Al-Douri, Y. (2022) · Nanomaterials · doi:10.3390/nano12132144 · Cited by 95
“[182] investigated the impact of a cooled liquid environment at room temperature.”
BackgroundFunctional nonlinear optical nanoparticles synthesized by laser ablation
Chen, L., & Hong, M. (2022) · Opto-Electronic Science · doi:10.29026/oes.2022.210007 · Cited by 26
Self-citationEnhancement of pulsed laser ablation in environmentally friendly liquid
Luo, F., Guan, Y., Ong, W., Du, Z., Ho, G., Li, F., Sun, S., Lim, G., & Hong, M. (2014) · Optics Express · doi:10.1364/oe.22.023875 · Cited by 24
Self-citation
Metadata
- Authors
- Hong, M. H., Ng, K. Y., Xie, Q., Shi, L. P., & Chong, T. C.
- Affiliations
- Data Storage Institute (SG)
- Corresponding author
- Hong, M. H.
- Venue
- Applied Physics A
- Published
- 2008-06-03
- Volume
- 93
- Issue
- 1
- Pages
- 153-157
- ISSN
- 0947-8396 (ISSN-L)
- 1432-0630
- OpenAlex
- W2021355572
- Cited by
- 17
- References
- 13
- Citations by year
- 2026: 2 · 2025: 1 · 2024: 2 · 2023: 1 · 2022: 2 · 2021: 3 · 2020: 1 · 2014: 1 · 2012: 1
- FWCI
- 1.05
- Type
- journal article
- Language
- en
- Open access
- closed
- Licence
- www.springer.com/tdm (tdm)
- Locations
- Applied Physics A (publishedVersion)
- National University of Singapore (submittedVersion)
- Topics
- Physical Sciences › Engineering › Industrial and Manufacturing Engineering › Laser Material Processing Techniques
- Physical Sciences › Materials Science › Materials Chemistry › Laser-Ablation Synthesis of Nanoparticles
- Physical Sciences › Engineering › Industrial and Manufacturing Engineering › Advanced Surface Polishing Techniques
- Keywords
- pulsed laser ablation, KOH solution, silicon substrate, material removal rate, liquid temperature, chemical interactions, wafer thinning, laser ablation in water
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Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
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Cite CoChat for the checks on this page, and the paper for its own findings.
- This page
- CoChat. (2026). Citation check: Pulsed laser ablation in a cooled liquid environment. https://app.cochat.ai/papers/10.1007/s00339-008-4675-z
- The paper
- Hong, M. H., Ng, K. Y., Xie, Q., Shi, L. P., & Chong, T. C. (2008). Pulsed laser ablation in a cooled liquid environment. Applied Physics A. https://doi.org/10.1007/s00339-008-4675-z
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
