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Experimental Description of the Al-Cu Binary Phase Diagram
Open accessAbstract
The phase diagram of the Al-Cu binary system was reinvestigated experimentally. The current study was designed to contribute to a better description of those parts of the phase diagram which are disputed in the current scientific literature, and in addition, to study the phase equilibria at 300 °C. The melting behavior of the θ-phase was confirmed to be peritectic. A metastable congruent solidification of the θ-phase was observed from the microstructural examination of as-cast samples. The location of the liquidus curve in this region of the phase diagram was more accurately defined using DSC measurements taken at slow-heating rates (1 °C min −1 ). The temperature stability of the ζ-phase was reevaluated and was found to lie in the range 373–597 °C. The phase boundaries of the γ′ + ε′ two-phase field were experimentally defined. Difficulties in defining the γ′/δ transition were addressed by a combined EDX/XRD investigation of more than ten samples that had been annealed in the temperature range of 500 to 750 °C. The (γ′ + δ) two-phase field was postulated from XRD studies of quenched samples. The temperature of the ordering reaction γ ↔ γ′ within the γ(γ′) + β phase field was experimentally determined to be 779.6 °C. All other parts of the Al-Cu phase diagram studied here were found to be in very good agreement with the most recent previous descriptions.
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“Following Truog et al.'s research [25] and the Al-Cu phase diagram [41], intermetallic phases can form during the UAM process due to local temperature rises.”
From Multi-layer solid-state ultrasonic additive manufacturing of aluminum/copper: local properties and texture (2024) · cites this paper as [41]
Experimental — accuracy not yet measuredThe source backs part of the claim, not all of it — or backs it for a different population, condition or comparison.
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“One of the main challenges is the formation of brittle intermetallic compounds (IMCs), such as AlCu, Al₂Cu, and Al₄Cu₉, which deteriorate the joint and compromise its reliability [5], [6], [7].”
From Effect of nickel interlayer thickness on intermetallic compound formation and interfacial integrity in pulsed laser welding of aluminum and copper (2026) · cites this paper as [5]
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“Considering the semi-quantitative EDS microanalysis (at. %: 66Al-34Cu, 46Al-52Cu, and 35Al-65Cu and for phase numbers 3, 2, and 1, respectively) and the data provided in Figure 3b, which indicated the solubility limits and crystallographic phases identified by Zobac et al. [19] in the Al-Cu binary system, these phases can be identified as θ (Al side), γ1 (Cu side), and a mixture of η2.”
From Solid-State Diffusion Bonding of Aluminum to Copper for Bimetallic Anode Fabrication (2024) · cites this paper as [19]
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Research works printed but not linked: 24
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Cited by
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Behvar, A., Shakil, S. I., Pirgazi, H., Norfolk, M., & Haghshenas, M. (2024) · The International Journal of Advanced Manufacturing Technology · doi:10.1007/s00170-024-13490-2 · Cited by 18
“Following Truog et al.’s research [25] and the Al-Cu phase diagram [41], intermetallic phases can form during the UAM process due to local temperature rises.”
Solid-State Diffusion Bonding of Aluminum to Copper for Bimetallic Anode Fabrication
de Prado, J., Børresen, B. T., Utrilla, V., & Ureña, A. (2024) · Materials · doi:10.3390/ma17215333 · Cited by 6
“…and for phase numbers 3, 2, and 1, respectively) and the data provided in Figure 3b, which indicated the solubility limits and crystallographic phases identified by Zobac et al. [19] in the Al-Cu binary system, these phases can be identified as θ (Al side), γ 1 (Cu side), and a mixture of η 2 .”
BackgroundSingh, R., Arora, N., & Choudhary, A. (2026) · Welding in the World · doi:10.1007/s40194-026-02375-5 · Cited by 6
“One of the main challenges is the formation of brittle inter-metallic compounds (IMCs), i.e., reaction layers or particles formed at the Al-Cu interface due to interdiffusion during welding, such as AlCu, Al ₂ Cu, and Al ₄ Cu ₉ , which deteriorate the joint and compromise its reliability [5–7].”
Metadata
- Authors
- Zobac, O., Kroupa, A., Zemanova, A., & Richter, K. W.
- Affiliations
- University of Vienna (AT)
- ORCID
- Richter, Klaus W.
- Venue
- Metallurgical and Materials Transactions A
- Published
- 2019-05-21
- Volume
- 50
- Issue
- 8
- Pages
- 3805-3815
- ISSN
- 1073-5623 (ISSN-L)
- 1543-1940
- OpenAlex
- W2944936569
- Cited by
- 176
- References
- 0
- Citations by year
- 2026: 27 · 2025: 34 · 2024: 33 · 2023: 26 · 2022: 23 · 2021: 21 · 2020: 10 · 2019: 2
- FWCI
- 22.26
- Type
- journal article
- Language
- en
- Open access
- hybrid
- doi.org
- Locations
- Metallurgical and Materials Transactions A (publishedVersion, cc-by)
- Phaidra (Universität Wien) (submittedVersion, cc-by-nc-nd)
- Funders
- Austrian Science Fund (M2293)
- Universität Wien
- Topics
- Physical Sciences › Materials Science › General Materials Science › Metallurgical and Alloy Processes
- Physical Sciences › Materials Science › Metals and Alloys › Aluminum Alloy Microstructure Properties
- Physical Sciences › Materials Science › Metals and Alloys › Thermodynamic and Structural Properties of Metals and Alloys
- Keywords
- phase diagram, phase equilibria, theta phase, incongruent melting, liquidus curves, zeta phase, γ′ precipitates, delta phase, solid solution ordering, metastable phases
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- Zobac, O., Kroupa, A., Zemanova, A., & Richter, K. W. (2019). Experimental Description of the Al-Cu Binary Phase Diagram. Metallurgical and Materials Transactions A. https://doi.org/10.1007/s11661-019-05286-x
