Cited by 31Advanced Welding Techniques AnalysisWelding Techniques and Residual StressesElectronic Packaging and Soldering Technologies

Growth Rate of Intermetallics in Aluminum to Copper Dissimilar Welding

Cheepu, Muralimohan, Susila, P.·2020·Transactions of the Indian Institute of Metals

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Crossref · 10.1007/s12666-020-01905-z

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Authors
Cheepu, M., & Susila, P.
Affiliations
Anna University, Chennai (IN)
Corresponding author
Susila, P.
Venue
Transactions of the Indian Institute of Metals
Published
2020-03-09
Volume
73
Issue
6
Pages
1509-1514
ISSN
  • 0972-2815 (ISSN-L)
  • 0975-1645
OpenAlex
W3010860508
Cited by
31
References
0
Citations by year
2025: 1 · 2024: 5 · 2023: 10 · 2022: 9 · 2021: 4 · 2020: 2
FWCI
3.07
Type
journal article
Language
en
Open access
closed
Locations
Transactions of the Indian Institute of Metals (publishedVersion)
Topics
  • Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
  • Physical Sciences › Engineering › Mechanical Engineering › Welding Techniques and Residual Stresses
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
Keywords
friction welding, intermetallic compounds, interdiffusion, heat treatment, intermetallic compound thickness, tensile strength, fracture morphology, copper-aluminum interface

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Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.

Statistics and arithmetic are recomputed, not judged.

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