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Interfacial phase formation of Al-Cu bimetal by solid-liquid casting method
Open accessAbstract
The solid-liquid method was used to prepare the continuous casting of copper cladding aluminium by liquid aluminum alloy and solid copper, and the interfacial phase formation of Al-Cu bimetal at different pouring temperatures (700, 750, 800 °C) was investigated by means of metallograph, scanning electron microscopy (SEM) and energy dispersive spectrometry (EDS) methods. The results showed that the pouring temperature of aluminum melt had an important influence on the element diffusion of Cu from the solid Cu to Al alloy melt and the reactions between Al and Cu, as well as the morphology of the Al-Cu interface. When the pouring temperature was 800 °C, there were abundant Al-Cu intermetallic compounds (IMCs) near the interface. However, a lower pouring temperature (700 °C) resulted in the formation of cavities which was detrimental to the bonding and mechanical properties. Under the conditions in this study, the good metallurgical bonding of Al-Cu was achieved at a pouring temperature of 750 °C.
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“However, cavities are reported only as a characteristic of a poor bond formation in the interfacial layer, which can be reduced by increasing the heat impact [2,3,5,16].”
From Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process (2022) · cites this paper as [3]
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“The thermal conditions in the casting process and, sequentially, the formation of intermetallic phases can be modified via several process parameters depending on the respective process.For example, these can be the pouring temperature [2,3], preheating temperature of the insert [4] or mold temperature/cladding temperature [5].”
From Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process (2022) · cites this paper as [3]
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Cited by
Sorted by citations
Nolte, N., Lukasczyk, T., & Mayer, B. (2022) · Metals · doi:10.3390/met12081314 · Cited by 5
“poor bond formation in the interfacial layer, which can be reduced by increasing the heat impact [2,3,5,16].”
BackgroundJassim, A. H., Abtaan, N. S., & Ahmed, S. R. (2024) · Tikrit Journal of Engineering Sciences · doi:10.25130/tjes.31.4.13
Metadata
- Authors
- Fu, Y., Zhang, Y.-B., Jie, J.-C., Svynarenko, K., Liang, C.-H., & Li, T.-J.
- Affiliations
- Dalian University of Technology (CN)
- ORCID
- Fu, Ying
- Venue
- China Foundry
- Published
- 2017-05
- Volume
- 14
- Issue
- 3
- Pages
- 194-198
- ISSN
- 1672-6421 (ISSN-L)
- 2365-9459
- OpenAlex
- W2627056359
- Cited by
- 24
- References
- 0
- Citations by year
- 2026: 1 · 2025: 3 · 2024: 3 · 2023: 3 · 2022: 3 · 2021: 2 · 2020: 3 · 2019: 3 · 2018: 3
- FWCI
- 1.91
- Type
- journal article
- Language
- en
- Open access
- gold
- doi.org
- Licence
- Locations
- China Foundry (publishedVersion, cc-by-nc)
- DOAJ (DOAJ: Directory of Open Access Journals) (submittedVersion, cc-by-sa)
- Funders
- National Natural Science Foundation of China (51501027)
- China Postdoctoral Science Foundation (2015M570246)
- Fundamental Research Funds for the Central Universities (DUT15RC(3)065, DUT 15RC)
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Physical Sciences › Materials Science › Metals and Alloys › Aluminum Alloy Microstructure Properties
- Keywords
- pouring temperature, interfacial phase formation, intermetallic compounds, metallurgical bonding, interface morphology, cavities
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- Fu, Y., Zhang, Y.-B., Jie, J.-C., Svynarenko, K., Liang, C.-H., & Li, T.-J. (2017). Interfacial phase formation of Al-Cu bimetal by solid-liquid casting method. China Foundry. https://doi.org/10.1007/s41230-017-6057-7
