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Cited by 391

The DOI matches its Crossref record; 96 of the 96 references it cites were found in a registry or an index.

Thermal properties and applications of microencapsulated PCM for thermal energy storage: A review

Huang, Xiang, Zhu, Chuqiao, Lin, Yaxue, Fang, Guiyin·2019·Applied Thermal Engineering

Abstract

Abstract Phase change materials (PCM) are characterized by storing a large amount of thermal energy while changing from one phase to another phase (normally solid–liquid states) at a certain temperature. The application of PCM devotes to elevate the global efforts to conserve energy with regard to fast depleting fossil fuels. The selection of supporting materials and encapsulation techniques has crucial effect on the use of the thermal energy released by PCM. The encapsulation method of PCM is an approach to alleviate leakage, phase separation and volume change problems. Microencapsulated phase change materials (MPCM) are one of the most popular techniques to enhance the efficiency in use of resources for thermal energy storage. This work attempts to summarize preparation methods and thermal properties of the MPCM, which helps to better understand the composition and working mechanism of the MPCM. Moreover, the MPCM provide enormous potential to meet the growing demands for applications of cooling and heating in buildings, textiles and MPCM slurry.

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Crossref · 10.1016/j.applthermaleng.2018.11.007

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Metadata

Authors
Huang, X., Zhu, C., Lin, Y., & Fang, G.
Venue
Applied Thermal Engineering
Publisher
Elsevier BV
Published
2019-01
Volume
147
Pages
841-855
ISSN
1359-4311 (ISSN-L)
OpenAlex
W2898633753
Cited by
391
References
96
FWCI
22.22
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: Thermal properties and applications of microencapsulated PCM for thermal energy storage: A review. https://app.cochat.ai/papers/10.1016/j.applthermaleng.2018.11.007
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Huang, X., Zhu, C., Lin, Y., & Fang, G. (2019). Thermal properties and applications of microencapsulated PCM for thermal energy storage: A review. Applied Thermal Engineering. https://doi.org/10.1016/j.applthermaleng.2018.11.007

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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.