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Effect of heat treatment on bonding mechanism and mechanical properties of high strength Cu/Al/Cu clad composite
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Each is checked against this paper’s own text: does it say what the citing paper says it does?
In the citing paper
“Regardless of method, the IMC formation at the Cu/Al interface is inevitable [6].”
From Influences of the Rolling Parameters on Multi-Material Copper-Aluminum Composites via Compound Casting (2026) · cites this paper as [6]
In the citing paper
“Other studies use elevated temperatures during rolling itself [12,6].”
From Influences of the Rolling Parameters on Multi-Material Copper-Aluminum Composites via Compound Casting (2026) · cites this paper as [6]
In the citing paper
“While roll bonding itself is a pressure welding process, the introduction of heat triggers diffusion processes, which can improve the bonding by forming IMC at the Cu/Al interface [6].”
From Influences of the Rolling Parameters on Multi-Material Copper-Aluminum Composites via Compound Casting (2026) · cites this paper as [6]
In the citing paper
“Reported threshold height reductions in roll bonding vary depending on the materials and the process parameters: values range from 40% [4], over 60% [5], up to 80% [6] height reduction during the decisive first rolling pass.”
From Influences of the Rolling Parameters on Multi-Material Copper-Aluminum Composites via Compound Casting (2026) · cites this paper as [6]
Citations
Cites
No references could be resolved yet.
Research works printed but not linked: 31
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- Chen, 2006, Influence of interfacial structure development on the fracture mechanism and bond strength of aluminum/copper bimetal plate, Mater. Trans., 4, 1232, 10.2320/matertrans.47.1232 · DOI
- Liao, 2017, Microstructure characterization of Al-cladded Al-Zn-Mg-Cu sheet in different hot deformation conditions, T. Nonferr. Metal Soc., 27, 1689, 10.1016/S1003-6326(17)60191-2 · DOI
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- Duan, 2017, Texture balancing in a fcc/bcc multilayered composite produced by accumulative roll bonding, Acta Mater., 123, 11, 10.1016/j.actamat.2016.10.023 · DOI
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- Wang, 2018, Microstructure, mechanical properties and interface bonding mechanism of hot-rolled stainless steel clad plates at different rolling reduction ratios, J. Alloy. Comp., 766, 517, 10.1016/j.jallcom.2018.06.109 · DOI
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- Akramifard, 2014, Estimating interface bonding strength in clad sheets based on tensile test results, Mater. Des., 64, 307, 10.1016/j.matdes.2014.07.066 · DOI
- Miyajima, 2014, Effects of rolling reduction and strength of composed layers on bond strength of pure copper and aluminium alloy clad sheets fabricated by cold roll bonding, Ann. Mater. Sci. Eng., 2014, 1
- Ma, 2016, Coupling of dislocations and precipitates: impact on the mechanical behavior of ultrafine grained Al-Zn-Mg alloys, Acta Mater., 103, 153, 10.1016/j.actamat.2015.09.017 · DOI
- Afifi, 2018, Mechanical properties of an Al-Zn-Mg alloy processed by ECAP and heat treatments, J. Alloy. Comp., 769, 631, 10.1016/j.jallcom.2018.07.343 · DOI
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- Sheng, 2011, Influence of heat treatment on interface of Cu/Al bimetal composite fabricated by cold rolling, Compos. B Eng., 42, 1468, 10.1016/j.compositesb.2011.04.045 · DOI · Paper page
- Lee, 2015, Effect of aging treatment on bonding interface properties of hot-pressed Cu/Al clad material, Int. J. Precis. Eng. Manuf., 16, 525, 10.1007/s12541-015-0071-8 · DOI
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- Huang, 2017, Evolution of bonding interface in solid-liquid cast-rolling bonding of Cu/Al clad strip, T. Nonferr. Metal Soc., 27, 1019, 10.1016/S1003-6326(17)60119-5 · DOI · Paper page
- Wang, 2014, Effects of Fe-Al intermetallic compounds on interfacial bonding of clad materials, T. Nonferr. Metal Soc., 24, 279, 10.1016/S1003-6326(14)63058-2 · DOI
- Liu, 2018, Effect of cooling rate on the microstructure and mechanical properties of Cu/Al bimetal fabricated by compound casting, Metall. Mater. Trans. A, 49, 661, 10.1007/s11661-017-4427-9 · DOI
- Kim, 2014, Mechanochemical joining in cold roll-cladding of tri-layered Cu/Al/Cu composite and the interface cracking behavior, Mater. Des., 57, 625, 10.1016/j.matdes.2014.01.054 · DOI
- Sun, 2015, Optical measurement of forming limit and formability of Cu/Al clad metals, J. Mater. Eng. Perform., 24, 1426, 10.1007/s11665-015-1435-z · DOI
- Zheng, 2013, High-strength and thermally stable bulk nanolayered composites due to twin-induced interfaces, Nat. Commun., 4, 1696, 10.1038/ncomms2651 · DOI
- Li, 2008, Progress in cold roll bonding of metals, Sci. Technol. Adv. Mater., 9, 23001, 10.1088/1468-6996/9/2/023001 · DOI
- Paul, 2013, Microstructure and phase constitution near the interface of explosively welded aluminum/copper plates, Metall. Mater. Trans. A, 44, 3836, 10.1007/s11661-013-1703-1 · DOI
- Babu, 2019, Microwave synthesized composite claddings with enhanced cavitation erosion resistance, Wear, 422–423, 242, 10.1016/j.wear.2019.01.072 · DOI
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- Huo, 2016, Warm formability and post-forming microstructure/property of high-strength AA 7075-T6 Al alloy, Mater. Sci. Eng. A, 675, 44, 10.1016/j.msea.2016.08.054 · DOI
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Cited by
Sorted by citations
Ringel, A., Demirezen, A. Z., Hoyer, J., Bailly, D., Kammerloher, S., Volk, W., & Lian, J. (2026) · Materials Science Forum · doi:10.4028/p-ifcfc6
“Regardless of method, the IMC formation at the Cu/Al interface is inevitable [6].”
Influential
Metadata
- Authors
- Wang, Y., Song, R., Yanagimoto, J., & Li, H.
- Affiliations
- University of Science and Technology Beijing (CN)
- The University of Tokyo (JP)
- Corresponding author
- Wang, Yongjin
- Song, Renbo
- Venue
- Journal of Alloys and Compounds
- Publisher
- Elsevier BV
- Published
- 2019-09
- Volume
- 801
- Pages
- 573-580
- ISSN
- 0925-8388 (ISSN-L)
- OpenAlex
- W2950402495
- Cited by
- 59
- References
- 0
- Citations by year
- 2026: 6 · 2025: 11 · 2024: 17 · 2023: 12 · 2022: 4 · 2021: 2 · 2020: 4 · 2019: 3
- FWCI
- 1.83
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Journal of Alloys and Compounds (publishedVersion)
- Funders
- Central Universities (FRF-TP-18-039A1)
- China Postdoctoral Science Foundation (2019M650482)
- China Scholarship Council (201606460014)
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
- Physical Sciences › Materials Science › Metals and Alloys › Microstructure and mechanical properties
- Physical Sciences › Engineering › Mechanical Engineering › Aluminum Alloys Composites Properties
- Keywords
- heat treatment, T6 heat treatment, annealing, interfacial bonding mechanism, intermetallic compound layer, 7075 aluminum alloy, peel strength, delamination, mechanical properties, high-strength aluminum alloys
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- This page
- CoChat. (2026). Citation check: Effect of heat treatment on bonding mechanism and mechanical properties of high strength Cu/Al/Cu clad composite. https://app.cochat.ai/papers/10.1016/j.jallcom.2019.06.132
- The paper
- Wang, Y., Song, R., Yanagimoto, J., & Li, H. (2019). Effect of heat treatment on bonding mechanism and mechanical properties of high strength Cu/Al/Cu clad composite. Journal of Alloys and Compounds. https://doi.org/10.1016/j.jallcom.2019.06.132