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Cited by 3

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Electrically assisted pressure joining of dissimilar copper C11000 and aluminum 6061-T6 alloys

Bui-Thi, Tu-Anh, Do, Thanh Thuong, Phan, Van Cong, Hong, Sung-Tae, Kim, Yijae, Han, Heung Nam·2025·Journal of Materials Science & Technology
DOI 10.1016/j.jmst.2025.02.026
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Metadata

Authors
Bui-Thi, T.-A., Do, T. T., Phan, V. C., Hong, S.-T., Kim, Y., & Han, H. N.
Venue
Journal of Materials Science & Technology
Publisher
Elsevier BV
Published
2025-11
Volume
234
Pages
90-101
ISSN
1005-0302
DOI
10.1016/j.jmst.2025.02.026
Cited by
3
References
1
Language
en
Licence
  • www.elsevier.com/tdm/userlicense/1.0/ (tdm)
  • www.elsevier.com/legal/tdmrep-license (tdm)
Funders
  • Korea Ministry of Education (2021RIS-003)
  • Korea Ministry of Trade Industry and Energy (20024345)
  • National Research Foundation of Korea
  • Ministry of Environment
  • Korea Ministry of Science and ICT (NRF-2021R1A2C3005096)

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CoChat. (2026). Citation check: Electrically assisted pressure joining of dissimilar copper C11000 and aluminum 6061-T6 alloys. https://app.cochat.ai/papers/10.1016/j.jmst.2025.02.026
The paper
Bui-Thi, T.-A., Do, T. T., Phan, V. C., Hong, S.-T., Kim, Y., & Han, H. N. (2025). Electrically assisted pressure joining of dissimilar copper C11000 and aluminum 6061-T6 alloys. Journal of Materials Science & Technology. https://doi.org/10.1016/j.jmst.2025.02.026

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Bibliographic data: Semantic Scholar, OpenAlex, Crossref.

Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.