Cited by 137Advanced Welding Techniques AnalysisWelding Techniques and Residual StressesElectronic Packaging and Soldering Technologies
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Interfacial microstructure evolution and weld formation during ultrasonic welding of Al alloy to Cu
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After micro-bonds between aluminum and copper form, intense shear deformation occurs parallel to ultrasonic vibrations, leading to a recrystallized microstructure with a shear texture aligned with the {111}⟨011⟩ orientation near the bonded interface.
“Fuji et al. [36] reported that after the establishment of micro-bonds between aluminum (Al) and copper (Cu), an intense shear deformation occurred in parallel with the ultrasonic vibrations.This process led to the creation of a recrystallized microstructure featuring a shear texture aligned with the {111}⟨011⟩ orientation near the bonded interface.”
From Multi-layer solid-state ultrasonic additive manufacturing of aluminum/copper: local properties and texture (2024) · cites this paper as [36]
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Research works printed but not linked: 39
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CHENG, X.-M., YANG, K., LIU, S.-Z., JI, S.-L., & WANG, J. (2023) · Transactions of Nonferrous Metals Society of China · doi:10.1016/s1003-6326(23)66315-0 · Cited by 25
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Metadata
- Authors
- Fujii, H. T., Endo, H., Sato, Y. S., & Kokawa, H.
- Affiliations
- Tohoku University (JP)
- Corresponding author
- Fujii, H.T.
- Venue
- Materials Characterization
- Publisher
- Elsevier BV
- Published
- 2018-05
- Volume
- 139
- Pages
- 233-240
- ISSN
- 1044-5803 (ISSN-L)
- OpenAlex
- W2800788989
- Cited by
- 137
- References
- 0
- Citations by year
- 2026: 17 · 2025: 18 · 2024: 21 · 2023: 20 · 2022: 20 · 2021: 12 · 2020: 16 · 2019: 11 · 2018: 2
- FWCI
- 6.55
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Materials Characterization (publishedVersion)
- Funders
- Japan Society for the Promotion of Science (24760590)
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
- Physical Sciences › Engineering › Mechanical Engineering › Welding Techniques and Residual Stresses
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Keywords
- ultrasonic spot welding, dissimilar metal welding, copper-aluminum interface, interfacial microstructure, anodized aluminum, material flow, compressive deformation, intermetallic compound growth, Al2Cu, recrystallization, shear texture, weld formation
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