The DOI matches its Crossref record; 13 of the 13 references it cites were found in a registry or an index.
Mechanical problems of novel back contact solar modules
Overview
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Claims other papers make about this one
Each is checked against this paper’s own text: does it say what the citing paper says it does?
In the citing paper
“As shown in Fig.4, the experimental data agree well with the Ramberg-Osgood model, with fit parameters reported in the literature to characterize copper[14][15].”
From Stress evolution and degradation in zero-busbar silicon photovoltaic modules under thermal cycling: A finite element study (2026) · cites this paper as [14]
Citations
Cites
Encapsulation of PV modules using ethylene vinyl acetate copolymer as a pottant: A critical review
Czanderna, A. W., & Pern, F. J. (1996) · Solar Energy Materials and Solar Cells · doi:10.1016/0927-0248(95)00150-6 · Cited by 592
Kempe, M. D., Jorgensen, G. J., Terwilliger, K. M., McMahon, T. J., Kennedy, C. E., & Borek, T. T. (2007) · Solar Energy Materials and Solar Cells · doi:10.1016/j.solmat.2006.10.009 · Cited by 312
Grid parity analysis of solar photovoltaic systems in Germany using experience curves
Bhandari, R., & Stadler, I. (2009) · Solar Energy · doi:10.1016/j.solener.2009.06.001 · Cited by 167
Characterisation of constitutive behaviour of SnAg, SnAgCu and SnPb solder in flip chip joints
Wiese, S., Feustel, F., & Meusel, E. (2002) · Sensors and Actuators A Physical · doi:10.1016/s0924-4247(01)00880-9 · Cited by 82
Self-citation17.9% Metal‐wrap‐through mc‐Si cells resulting in module efficiency of 17.0%
Lamers, M. W. P. E., Tjengdrawira, C., Koppes, M., Bennett, I. J., Bende, E. E., Visser, T. P., Kossen, E. J., Brockholz, B., Mewe, A. A., Romijn, I. G., et al. (2011) · Progress in Photovoltaics Research and Applications · doi:10.1002/pip.1110 · Cited by 57
Joubert, C., Michel, A., Choplin, L., & Cassagnau, P. (2003) · Journal of Polymer Science Part B Polymer Physics · doi:10.1002/polb.10530 · Cited by 43
A novel module assembly line using back contact solar cells
Spath, M., de Jong, P. C., Bennett, I. J., Visser, T. P., & Bakker, J. (2008) · Conference record of the IEEE Photovoltaic Specialists Conference · doi:10.1109/pvsc.2008.4922528 · Cited by 35
Mechanical behaviour and fatigue of copper ribbons used as solar cell interconnectors
Wiese, S., Meier, R., & Kraemer, F. (2010) · 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) · doi:10.1109/esime.2010.5464551 · Cited by 33
Self-citationReliability of copper-ribbons in photovoltaic modules under thermo-mechanical loading
Meier, R., Kraemer, F., Wiese, S., et al. (2010) · 2010 35th IEEE Photovoltaic Specialists Conference · doi:10.1109/pvsc.2010.5614220 · Cited by 23
Self-citationReaching 16.4% Module Efficiency with Back-Contacted mc-Si Solar Cells
Mewe, A. A., Lamers, M. W. P. E., Bennett, I. J., Koppes, M., Romijn, I. G., & Weeber, A. W. (2009) · EU PVSEC · doi:10.4229/24theupvsec2009-2ao.2.4 · Cited by 6
Research works printed but not linked: 2
- van Kerschaver E, Beaucarne G. Back-contact solar cells. In: A Review, Prog. Photovolt: Res. Appl. 2006; 14: 107–123.
- de Jong PC et al., Single- step laminated full size PV modules with back-contacted MC-cells and conductive adhesives. In: Proc. 19th European Photovoltaic Solar Energy Conference, Paris, France; 2004.
Cited by
Liu, H., Nair, S. V., Gu, H., Yang, B., Wu, J., Yan, X., Lv, R., Dong, J., Yu, Y., Xu, T., et al. (2026) · Solar Energy · doi:10.1016/j.solener.2025.114206
Metadata
- Authors
- Kraemer, F., Wiese, S., Peter, E., & Seib, J.
- Affiliations
- Saarland University (DE)
- Robert Bosch (Germany) (DE)
- ORCID
- Wiese, Steffen
- Venue
- Microelectronics Reliability
- Publisher
- Elsevier BV
- Published
- 2013-08
- Volume
- 53
- Issue
- 8
- Pages
- 1095-1100
- ISSN
- 0026-2714 (ISSN-L)
- OpenAlex
- W2054766869
- Cited by
- 22
- References
- 13
- Citations by year
- 2025: 1 · 2023: 3 · 2022: 1 · 2021: 3 · 2020: 1 · 2019: 3 · 2017: 4 · 2016: 2 · 2015: 3 · 2013: 1
- FWCI
- 1.20
- Type
- journal article
- Language
- en
- Open access
- closed
- Licence
- www.elsevier.com/tdm/userlicense/1.0/ (tdm)
- Locations
- Microelectronics Reliability (publishedVersion)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon and Solar Cell Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Physical Sciences › Energy › Renewable Energy, Sustainability and the Environment › Photovoltaic Systems and Sustainability
- Keywords
- thermomechanical damage, mechanical stress, solder joints, busbars, thermal cycling, module lifetime, finite element analysis
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
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How to cite
Cite CoChat for the checks on this page, and the paper for its own findings.
- This page
- CoChat. (2026). Citation check: Mechanical problems of novel back contact solar modules. https://app.cochat.ai/papers/10.1016/j.microrel.2013.02.019
- The paper
- Kraemer, F., Wiese, S., Peter, E., & Seib, J. (2013). Mechanical problems of novel back contact solar modules. Microelectronics Reliability. https://doi.org/10.1016/j.microrel.2013.02.019
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
