The DOI matches its Crossref record.
Lifetime extension through Tj equalisation by use of intelligent gate driver with multi-chip power module
Overview
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
Claims other papers make about this one
Each is checked against this paper’s own text: does it say what the citing paper says it does?
In the citing paper
“Another active gate delay control technique is presented in [49] using the junction temperature measurement of the power devices.The online junction temperature of corresponding devices is measured using the thermo-sensitive electric parameter (TSEP) method, which is integrated with a gate-driving unit to estimate the junction temperature of the individual devices.”
From Paralleling of IGBT Power Semiconductor Devices and Reliability Issues (2023) · cites this paper as [49]
In the citing paper
“The internal gate resistance is a TSEP considering its dependence on the chip temperature.”
From Paralleling of IGBT Power Semiconductor Devices and Reliability Issues (2023) · cites this paper as [49]
Citations
Cites
No references could be resolved yet.
Research works printed but not linked: 3
- Lobsiger, 2012, Closed-loop IGBT gate drive featuring highly dynamic di/dt and dv/dt control, 2012, IEEE Energy Convers. Congr. Expo., 4754
- Bortis, 2009, Double-stage gate drive circuit for parallel connected IGBT modules, IEEE Trans. Dielectr. Electr. Insul., 16, 1020, 10.1109/TDEI.2009.5211849 · DOI
- Brandelero, 2018, On-line virtual junction temperature measurement via DC gate current injection, CIPS, 2018
Cited by
Paralleling of IGBT Power Semiconductor Devices and Reliability Issues
Tripathi, R. N., & Omura, I. (2023) · Electronics · doi:10.3390/electronics12183826 · Cited by 14
Metadata
- Authors
- Brandelero, J., Ewanchuk, J., Degrenne, N., & Mollov, S.
- Venue
- Microelectronics Reliability
- Publisher
- Elsevier BV
- Published
- 2018-09
- Volume
- 88-90
- Pages
- 428-432
- ISSN
- 0026-2714
- Cited by
- 9
- References
- 0
- Language
- en
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
How to cite
Cite CoChat for the checks on this page, and the paper for its own findings.
- This page
- CoChat. (2026). Citation check: Lifetime extension through Tj equalisation by use of intelligent gate driver with multi-chip power module. https://app.cochat.ai/papers/10.1016/j.microrel.2018.07.034
- The paper
- Brandelero, J., Ewanchuk, J., Degrenne, N., & Mollov, S. (2018). Lifetime extension through Tj equalisation by use of intelligent gate driver with multi-chip power module. Microelectronics Reliability. https://doi.org/10.1016/j.microrel.2018.07.034
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
