The DOI matches its Crossref record; 38 of the 38 references it cites were found in a registry or an index.
Analysis of hardness–tensile strength relationships for electroformed nanocrystalline materials
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In the citing paper
“On the other hand, Eq. 5 can be used to estimate the increased yield strength around the Al-Cu interface based on the literature concerning the relationship between yield strength and hardness [52,53].”
From Multi-layer solid-state ultrasonic additive manufacturing of aluminum/copper: local properties and texture (2024) · cites this paper as [53]
Citations
Cites
Cullity, B. D., & Weymouth, J. W. (1957) · American Journal of Physics · doi:10.1119/1.1934486 · Cited by 17,935
Atkins, E. (1978) · Physics Bulletin · doi:10.1088/0031-9112/29/12/034 · Cited by 7,110
Materials science and engineering: An introduction
Clayton, C. R. (1987) · Materials Science and Engineering · doi:10.1016/0025-5416(87)90343-0 · Cited by 5,925
Materials Science and Engineering: An Introduction
Callister, W. D. (1985) · Cited by 5,351
(1962) · Journal of the Franklin Institute · doi:10.1016/s0016-0032(62)91145-6 · Cited by 4,391
Tabor, D. (2000) · doi:10.1093/oso/9780198507765.001.0001 · Cited by 3,118
Scaling, dimensional analysis, and indentation measurements
Cheng, Y.-T., & Cheng, C.-M. (2004) · Materials Science and Engineering: R: Reports · doi:10.1016/j.mser.2004.05.001 · Cited by 1,061
The determination of yield strength from hardness measurements
Cahoon, J. R., Broughton, W. H., & Kutzak, A. R. (1971) · Metallurgical Transactions · doi:10.1007/bf02913433 · Cited by 793
Introduction to materials science for engineers
Shackelford, J. F. (1985) · Cited by 781
Nano-sized twins induce high rate sensitivity of flow stress in pure copper
Lu, L., Schwaiger, R., Shan, Z., Dao, M., Lu, K., & Suresh, S. (2005) · Acta Materialia · doi:10.1016/j.actamat.2005.01.031 · Cited by 695
Research works printed but not linked: 6
- H.E. Boyer, T.L. Gall (Eds.), Metals Handbook, Desk ed., ASM International, Metals Park (OH), 1985, p. 1–60.
- U. Erb, A.M. El-Sherik, US Patent #5,352,266 (1994).
- U. Erb, A.M. El-Sherik, C.K.S. Cheung, M.J. Aus, US Patent #5,433,797 (1995).
- H. Wei, M.A.Sc. Thesis, University of Toronto, 2006.
- McMahon, 1989, Microstr. Sci., 17, 447
- Tabor, 1951, J. Inst. Met., 79, 1
Cited by
Khodabakhshi, F., Haghshenas, M., Eskandari, H., & Koohbor, B. (2015) · Materials Science and Engineering: A · doi:10.1016/j.msea.2015.03.122 · Cited by 157
Behvar, A., Shakil, S. I., Pirgazi, H., Norfolk, M., & Haghshenas, M. (2024) · The International Journal of Advanced Manufacturing Technology · doi:10.1007/s00170-024-13490-2 · Cited by 18
Metadata
- Authors
- Brooks, I., Lin, P., Palumbo, G., Hibbard, G. D., & Erb, U.
- Affiliations
- University of Toronto (CA)
- Corresponding author
- Brooks, I.
- Venue
- Materials Science and Engineering: A
- Publisher
- Elsevier BV
- Published
- 2008-09
- Volume
- 491
- Issue
- 1-2
- Pages
- 412-419
- ISSN
- 0921-5093 (ISSN-L)
- OpenAlex
- W2086778769
- Cited by
- 119
- References
- 38
- Citations by year
- 2026: 1 · 2025: 7 · 2024: 7 · 2023: 7 · 2022: 6 · 2021: 9 · 2020: 5 · 2019: 8 · 2018: 13 · 2017: 7 · 2016: 5 · 2015: 12 · 2014: 7 · 2013: 3 · 2012: 3
- FWCI
- 3.23
- Type
- journal article
- Language
- en
- Open access
- closed
- Licence
- www.elsevier.com/tdm/userlicense/1.0/ (tdm)
- Locations
- Materials Science and Engineering A (publishedVersion)
- Topics
- Physical Sciences › Materials Science › Metals and Alloys › Microstructure and mechanical properties
- Physical Sciences › Materials Science › Surfaces, Coatings and Films › Electrodeposition and Electroless Coatings
- Physical Sciences › Engineering › Mechanics of Materials › Metal and Thin Film Mechanics
- Keywords
- nanocrystalline materials, electroforming, electrodeposited nickel, ultrafine-grained metals, Vickers hardness, ultimate tensile strength, yield strength, strain hardening, ductility, necking instability, microstructure
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Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
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Cite CoChat for the checks on this page, and the paper for its own findings.
- This page
- CoChat. (2026). Citation check: Analysis of hardness–tensile strength relationships for electroformed nanocrystalline materials. https://app.cochat.ai/papers/10.1016/j.msea.2008.02.015
- The paper
- Brooks, I., Lin, P., Palumbo, G., Hibbard, G. D., & Erb, U. (2008). Analysis of hardness–tensile strength relationships for electroformed nanocrystalline materials. Materials Science and Engineering: A. https://doi.org/10.1016/j.msea.2008.02.015
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
