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Cited by 145Advanced Welding Techniques AnalysisAdditive Manufacturing Materials and ProcessesMicrostructure and mechanical properties

The DOI matches its Crossref record.

Bonding characteristics during very high power ultrasonic additive manufacturing of copper

Sriraman, M.R., Babu, S.S., Short, M.·2010·Scripta Materialia
DOI 10.1016/j.scriptamat.2009.12.040
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Crossref · 10.1016/j.scriptamat.2009.12.040

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  • Oxide dispersion permits nascent metal surfaces to interact and form metallic connections, whereas surface asperity deformation promotes dynamic recrystallization of the interface microstructure.

    “Oxide dispersion permits nascent metal surfaces to interact and form metallic connections, whereas surface asperity deformation promotes dynamic recrystallization of the interface microstructure [19,20].”

    From Multi-layer solid-state ultrasonic additive manufacturing of aluminum/copper: local properties and texture (2024) · cites this paper as [19]

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Metadata

Authors
Sriraman, M. R., Babu, S. S., & Short, M.
Affiliations
  • The Ohio State University (US)
  • Edison Welding Institute (US)
Corresponding author
Sriraman, M.R.
ORCID
Venue
Scripta Materialia
Publisher
Elsevier BV
Published
2010-04
Volume
62
Issue
8
Pages
560-563
ISSN
1359-6462 (ISSN-L)
DOI
10.1016/j.scriptamat.2009.12.040
OpenAlex
W1971822367
Cited by
145
References
0
Citations by year
2026: 4 · 2025: 7 · 2024: 9 · 2023: 13 · 2022: 23 · 2021: 14 · 2020: 17 · 2019: 8 · 2018: 11 · 2017: 5 · 2016: 10 · 2015: 8 · 2014: 4 · 2013: 1 · 2012: 2
FWCI
6.91
Type
journal article
Language
en
Open access
closed
Licence
www.elsevier.com/tdm/userlicense/1.0/ (tdm)
Locations
Scripta Materialia (publishedVersion)
Topics
  • Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
  • Physical Sciences › Engineering › Mechanical Engineering › Additive Manufacturing Materials and Processes
  • Physical Sciences › Materials Science › Metals and Alloys › Microstructure and mechanical properties
Keywords
ultrasonic additive manufacturing, copper foil, ultrasonic welding, metallurgical bonding, dynamic recrystallization, grain boundary migration, grain refinement, softening, plastic flow, three-dimensional parts

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