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Experimental study of a low-cost reversible thermal diode for advanced heat manipulation
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Nashine, C., Pandey, M., & Baraya, K. K. (2024) · Applied Thermal Engineering · doi:10.1016/j.applthermaleng.2024.124814 · Cited by 12
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Metadata
- Authors
- Kang, Z., & Fan, J.
- Affiliations
- Hong Kong Polytechnic University (HK)
- Corresponding author
- Fan, Jintu
- Venue
- Thermal Science and Engineering Progress
- Publisher
- Elsevier BV
- Published
- 2024-07
- Volume
- 52
- Pages
- 102662
- ISSN
- 2451-9049 (ISSN-L)
- OpenAlex
- W4399056769
- Cited by
- 7
- References
- 40
- Citations by year
- 2026: 2 · 2025: 2 · 2024: 3
- FWCI
- 0.94
- Type
- journal article
- Language
- en
- Open access
- closed
- Licence
- Locations
- Thermal Science and Engineering Progress (publishedVersion)
- Funders
- Research Grants Council, University Grants Committee (15216722)
- The Hong Kong Polytechnic University
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Heat Transfer and Boiling Studies
- Physical Sciences › Materials Science › Surfaces, Coatings and Films › Surface Modification and Superhydrophobicity
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Keywords
- thermal diode, heat rectification, superhydrophobic surfaces, superhydrophilic surfaces, filling factor, control valves, waste heat recovery, solar energy harvesting, building energy management
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