Review of metal matrix composites with high thermal conductivity for thermal management applications

Abstract

Metal matrix composites with high thermal conductivity and tailorable coefficient of thermal expansion are found widespread applications in electronic package and thermal management. The latest advances in manufacturing process, thermal properties and brazing technology of SiC/metal, carbon/metal and diamond/metal composites were presented. Key factors controlling the thermo-physical properties were discussed in detail. The problems involved in the fabrication and the brazing of these composites were elucidated and the main focus was put on the discussion of the methods to overcome these difficulties. This review shows that the combination of pressureless infiltration and powder injection molding offers the benefits to produce near-net shape composites. Improving wettability and optimizing interfacial structure are prerequisites for successful fabrication and further enhancement of thermal properties. A new Ag-Cu-Sn brazing alloy with low melting point is found to be effective to braze Al-matrix composites.