The DOI matches its Crossref record.
Effect of immersion Ni plating on interface microstructure and mechanical properties of Al/Cu bimetal
Overview
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Self-check
Percentages, sums and reported differences re-computed from the paper’s own numbers.
The self-check needs the paper’s full text.
Citations
Cites
No references could be resolved yet.
Research works printed but not linked: 26
- SARSILMAZ, 2012, Weldability characteristics of dissimilar Al/Cu friction stir weld joints [J], Materials Testing, 54, 85, 10.3139/120.110300 · DOI
- LEE, 2012, Effect of bonding interface on delamination behavior of drawn Cu/Al bar clad material [J], Transactions of Nonferrous Metals Society of China, 22, s645, 10.1016/S1003-6326(12)61779-8 · DOI
- SASAKE, 2010, Formation of ultra-fine copper grains in copper-clad aluminum wire [J], Scripta Materialia, 63, 488, 10.1016/j.scriptamat.2010.05.010 · DOI
- XIA, 2008, Microstructure and phase constitution near the interface of Cu/Al vacuum brazing using Al–Si filler metal [J], Vacuum, 82, 799, 10.1016/j.vacuum.2007.11.007 · DOI
- XIA, 2007, Microstructure and phase constitution near interface of Cu/Al vacuum brazing [J], Materials Science and Technology, 23, 815, 10.1179/174328407X168946 · DOI
- ESLAMI, 2011, An investigation on diffusion of aluminum to copper using equal channel angular extrusion process [J], Materials Letters, 65, 1862, 10.1016/j.matlet.2011.03.053 · DOI
- RHEE, 2004, Fabrication of aluminum/copper clad composite using hot hydrostatic extrusion process and its material characteristics [J], Materials Science and Engineering A, 384, 70, 10.1016/j.msea.2004.05.051 · DOI · Paper page
- CHEN, 2007, Effect of annealing on the interfacial structure of aluminum–copper joints [J], Materials Transactions, 48, 1938, 10.2320/matertrans.MER2006371 · DOI
- ABDOLLAH-ZADEH, 2008, Microstructural and mechanical properties of friction stir welded aluminum/copper lap joints [J], Journal of Alloys and Compounds, 460, 535, 10.1016/j.jallcom.2007.06.009 · DOI
- SABETGHADAM, 2010, Diffusion bonding of 410 stainless steel to copper using a nickel interlayer [J], Materials Characterization, 61, 626, 10.1016/j.matchar.2010.03.006 · DOI
- ABBASI, 2001, Growth rate of intermetallic compounds in Al/Cu bimetal produced by cold roll welding process [J], Journal of Alloys and Compounds, 319, 233, 10.1016/S0925-8388(01)00872-6 · DOI · Paper page
- ZHANG, 2013, Effect of Al thin film and Ni foil interlayer on diffusion bonded Mg–Al dissimilar joints [J], Journal of Alloys and Compounds, 556, 139, 10.1016/j.jallcom.2012.12.106 · DOI · Paper page
- ZHANG, 2012, An investigation on diffusion bonding of aluminum and magnesium using a Ni interlayer [J], Materials Letters, 83, 189, 10.1016/j.matlet.2012.06.014 · DOI
- LUO, 2013, Interfacial microstructure and mechanical strength of 93W/Ta diffusion-bonded joints with Ni interlayer [J], Metallurgical and Materials Transactions A, 44, 602, 10.1007/s11661-012-1570-1 · DOI
- KUNDU, 2008, Characterization of diffusion bonded joint between titanium and 304 stainless steel using a Ni interlayer [J], Materials Characterization, 59, 631, 10.1016/j.matchar.2007.05.015 · DOI
- HIRSCH, 2000, Immersion plating [J], Metal Finishing, 98, 436, 10.1016/S0026-0576(00)80352-9 · DOI
- MIRJALILI, 2013, On the kinetics of TiAl3 intermetallic layer formation in the titanium and aluminum diffusion couple [J], Intermetallics, 32, 297, 10.1016/j.intermet.2012.08.017 · DOI
- LEE, 2013, Solid-state bonding between Al and Cu by vacuum pressing [J], Transactions of Nonferrous Metals Society of China, 23, 341, 10.1016/S1003-6326(13)62467-X · DOI
- HENESS, 2008, Interfacial strength development of roll-bonded aluminium/copper metal laminates [J], Materials Science and Engineering A, 483–484, 740, 10.1016/j.msea.2006.09.184 · DOI · Paper page
- KE, 2010, Al–Ni intermetallic composites produced in situ by friction stir processing [J], Journal of Alloys and Compounds, 503, 494, 10.1016/j.jallcom.2010.05.040 · DOI
- LÓPEZ, 2002, Phase characterization of diffusion soldered Ni/Al/Ni interconnections [J], Interface Science, 10, 13, 10.1023/A:1015172710411 · DOI
- GUO, 2011, Intermetallic phase formation in diffusion-bonded Cu/Al laminates [J], Journal of Materials Science, 46, 2467, 10.1007/s10853-010-5093-0 · DOI
- ANAND, 1965, Diffusion of copper in nickel and aluminum [J], Journal of Applied Physics, 36, 3860, 10.1063/1.1713963 · DOI
- BERNARDINI, 1973, Ruthenium and nickel pipe diffusion in copper [J], Acta Metallurgica, 21, 1571, 10.1016/0001-6160(73)90100-4 · DOI
- TANAKA, 2007, Growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al [J], Materials Science and Engineering A, 445–446, 355, 10.1016/j.msea.2006.09.047 · DOI
- HANG, 2008, Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging [J], Microelectronics Reliability, 48, 416, 10.1016/j.microrel.2007.06.008 · DOI
Cited by
Bakke, A. O., Arnberg, L., & Li, Y. (2021) · Materials Science and Engineering: A · doi:10.1016/j.msea.2021.140979 · Cited by 20
Jassim, A. H., Abtaan, N. S., & Ahmed, S. R. (2024) · Tikrit Journal of Engineering Sciences · doi:10.25130/tjes.31.4.13
Metadata
- Authors
- ZHAO, J.-L., JIE, J.-C., CHEN, F., CHEN, H., LI, T.-J., & CAO, Z.-Q.
- Venue
- Transactions of Nonferrous Metals Society of China
- Publisher
- Elsevier BV
- Published
- 2014-06
- Volume
- 24
- Issue
- 6
- Pages
- 1659-1665
- ISSN
- 1003-6326
- Cited by
- 22
- References
- 0
- Language
- en
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
How to cite
Cite CoChat for the checks on this page, and the paper for its own findings.
- This page
- CoChat. (2026). Citation check: Effect of immersion Ni plating on interface microstructure and mechanical properties of Al/Cu bimetal. https://app.cochat.ai/papers/10.1016/s1003-6326(14)63238-6
- The paper
- ZHAO, J.-L., JIE, J.-C., CHEN, F., CHEN, H., LI, T.-J., & CAO, Z.-Q. (2014). Effect of immersion Ni plating on interface microstructure and mechanical properties of Al/Cu bimetal. Transactions of Nonferrous Metals Society of China. https://doi.org/10.1016/s1003-6326(14)63238-6