Student or educator? Sign up with your school email and get 6 months of Pro free.
Cited by 22

The DOI matches its Crossref record.

Effect of immersion Ni plating on interface microstructure and mechanical properties of Al/Cu bimetal

ZHAO, Jia-lei, JIE, Jin-chuan, CHEN, Fei, CHEN, Hang, LI, Ting-ju, CAO, Zhi-qiang·2014·Transactions of Nonferrous Metals Society of China

Overview

The claims and statistics of this paper haven’t been checked yet.

Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.

A few free checks a day · papers already verified open instantly · results are public

Integrity signals

Registry

Crossref · 10.1016/s1003-6326(14)63238-6

Cites

Statistics

Verification

Claims the paper makes

The claims and statistics of this paper haven’t been checked yet.

Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.

A few free checks a day · papers already verified open instantly · results are public

Self-check

Percentages, sums and reported differences re-computed from the paper’s own numbers.

The self-check needs the paper’s full text.

Citations

Cites

No references could be resolved yet.

Research works printed but not linked: 26

  1. SARSILMAZ, 2012, Weldability characteristics of dissimilar Al/Cu friction stir weld joints [J], Materials Testing, 54, 85, 10.3139/120.110300 · DOI
  2. LEE, 2012, Effect of bonding interface on delamination behavior of drawn Cu/Al bar clad material [J], Transactions of Nonferrous Metals Society of China, 22, s645, 10.1016/S1003-6326(12)61779-8 · DOI
  3. SASAKE, 2010, Formation of ultra-fine copper grains in copper-clad aluminum wire [J], Scripta Materialia, 63, 488, 10.1016/j.scriptamat.2010.05.010 · DOI
  4. XIA, 2008, Microstructure and phase constitution near the interface of Cu/Al vacuum brazing using Al–Si filler metal [J], Vacuum, 82, 799, 10.1016/j.vacuum.2007.11.007 · DOI
  5. XIA, 2007, Microstructure and phase constitution near interface of Cu/Al vacuum brazing [J], Materials Science and Technology, 23, 815, 10.1179/174328407X168946 · DOI
  6. ESLAMI, 2011, An investigation on diffusion of aluminum to copper using equal channel angular extrusion process [J], Materials Letters, 65, 1862, 10.1016/j.matlet.2011.03.053 · DOI
  7. RHEE, 2004, Fabrication of aluminum/copper clad composite using hot hydrostatic extrusion process and its material characteristics [J], Materials Science and Engineering A, 384, 70, 10.1016/j.msea.2004.05.051 · DOI · Paper page
  8. CHEN, 2007, Effect of annealing on the interfacial structure of aluminum–copper joints [J], Materials Transactions, 48, 1938, 10.2320/matertrans.MER2006371 · DOI
  9. ABDOLLAH-ZADEH, 2008, Microstructural and mechanical properties of friction stir welded aluminum/copper lap joints [J], Journal of Alloys and Compounds, 460, 535, 10.1016/j.jallcom.2007.06.009 · DOI
  10. SABETGHADAM, 2010, Diffusion bonding of 410 stainless steel to copper using a nickel interlayer [J], Materials Characterization, 61, 626, 10.1016/j.matchar.2010.03.006 · DOI
  11. ABBASI, 2001, Growth rate of intermetallic compounds in Al/Cu bimetal produced by cold roll welding process [J], Journal of Alloys and Compounds, 319, 233, 10.1016/S0925-8388(01)00872-6 · DOI · Paper page
  12. ZHANG, 2013, Effect of Al thin film and Ni foil interlayer on diffusion bonded Mg–Al dissimilar joints [J], Journal of Alloys and Compounds, 556, 139, 10.1016/j.jallcom.2012.12.106 · DOI · Paper page
  13. ZHANG, 2012, An investigation on diffusion bonding of aluminum and magnesium using a Ni interlayer [J], Materials Letters, 83, 189, 10.1016/j.matlet.2012.06.014 · DOI
  14. LUO, 2013, Interfacial microstructure and mechanical strength of 93W/Ta diffusion-bonded joints with Ni interlayer [J], Metallurgical and Materials Transactions A, 44, 602, 10.1007/s11661-012-1570-1 · DOI
  15. KUNDU, 2008, Characterization of diffusion bonded joint between titanium and 304 stainless steel using a Ni interlayer [J], Materials Characterization, 59, 631, 10.1016/j.matchar.2007.05.015 · DOI
  16. HIRSCH, 2000, Immersion plating [J], Metal Finishing, 98, 436, 10.1016/S0026-0576(00)80352-9 · DOI
  17. MIRJALILI, 2013, On the kinetics of TiAl3 intermetallic layer formation in the titanium and aluminum diffusion couple [J], Intermetallics, 32, 297, 10.1016/j.intermet.2012.08.017 · DOI
  18. LEE, 2013, Solid-state bonding between Al and Cu by vacuum pressing [J], Transactions of Nonferrous Metals Society of China, 23, 341, 10.1016/S1003-6326(13)62467-X · DOI
  19. HENESS, 2008, Interfacial strength development of roll-bonded aluminium/copper metal laminates [J], Materials Science and Engineering A, 483–484, 740, 10.1016/j.msea.2006.09.184 · DOI · Paper page
  20. KE, 2010, Al–Ni intermetallic composites produced in situ by friction stir processing [J], Journal of Alloys and Compounds, 503, 494, 10.1016/j.jallcom.2010.05.040 · DOI
  21. LÓPEZ, 2002, Phase characterization of diffusion soldered Ni/Al/Ni interconnections [J], Interface Science, 10, 13, 10.1023/A:1015172710411 · DOI
  22. GUO, 2011, Intermetallic phase formation in diffusion-bonded Cu/Al laminates [J], Journal of Materials Science, 46, 2467, 10.1007/s10853-010-5093-0 · DOI
  23. ANAND, 1965, Diffusion of copper in nickel and aluminum [J], Journal of Applied Physics, 36, 3860, 10.1063/1.1713963 · DOI
  24. BERNARDINI, 1973, Ruthenium and nickel pipe diffusion in copper [J], Acta Metallurgica, 21, 1571, 10.1016/0001-6160(73)90100-4 · DOI
  25. TANAKA, 2007, Growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al [J], Materials Science and Engineering A, 445–446, 355, 10.1016/j.msea.2006.09.047 · DOI
  26. HANG, 2008, Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging [J], Microelectronics Reliability, 48, 416, 10.1016/j.microrel.2007.06.008 · DOI

Cited by

Metadata

Authors
ZHAO, J.-L., JIE, J.-C., CHEN, F., CHEN, H., LI, T.-J., & CAO, Z.-Q.
Venue
Transactions of Nonferrous Metals Society of China
Publisher
Elsevier BV
Published
2014-06
Volume
24
Issue
6
Pages
1659-1665
ISSN
1003-6326
Cited by
22
References
0
Language
en

About these checks

Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.

Statistics and arithmetic are recomputed, not judged.

Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.

What counts as a claim ›How we measure confidence ›How we check this ›

Are you an author, or do you see a problem with this page? Request a review

How to cite

Cite CoChat for the checks on this page, and the paper for its own findings.

This page
CoChat. (2026). Citation check: Effect of immersion Ni plating on interface microstructure and mechanical properties of Al/Cu bimetal. https://app.cochat.ai/papers/10.1016/s1003-6326(14)63238-6
The paper
ZHAO, J.-L., JIE, J.-C., CHEN, F., CHEN, H., LI, T.-J., & CAO, Z.-Q. (2014). Effect of immersion Ni plating on interface microstructure and mechanical properties of Al/Cu bimetal. Transactions of Nonferrous Metals Society of China. https://doi.org/10.1016/s1003-6326(14)63238-6