The DOI matches its Crossref record; 1 of the 1 references it cites were found in a registry or an index.
Low-Temperature Oxidation-Free Selective Laser Sintering of Cu Nanoparticle Paste on a Polymer Substrate for the Flexible Touch Panel Applications
Abstract
Copper nanomaterials suffer from severe oxidation problem despite the huge cost effectiveness. The effect of two different processes for conventional tube furnace heating and selective laser sintering on copper nanoparticle paste is compared in the aspects of chemical, electrical and surface morphology. The thermal behavior of the copper thin films by furnace and laser is compared by SEM, XRD, FT-IR, and XPS analysis. The selective laser sintering process ensures low annealing temperature, fast processing speed with remarkable oxidation suppression even in air environment while conventional tube furnace heating experiences moderate oxidation even in Ar environment. Moreover, the laser-sintered copper nanoparticle thin film shows good electrical property and reduced oxidation than conventional thermal heating process. Consequently, the proposed selective laser sintering process can be compatible with plastic substrate for copper based flexible electronics applications.
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Cites
Pan, L., Chortos, A., Yu, G., Wang, Y., Isaacson, S., Allen, R., Shi, Y., Dauskardt, R., & Bao, Z. (2014) · Nature Communications · doi:10.1038/ncomms4002 · Cited by 1,519
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Huang, Y., Fan, X., Chen, S., & Zhao, N. (2019) · Advanced Functional Materials · doi:10.1002/adfm.201808509 · Cited by 543
Recent developments in polymers/polymer nanocomposites for additive manufacturing
Wu, H., Fahy, W. P., Kim, S., Kim, H., Zhao, N., Pilato, L., Kafi, A., Bateman, S., & Koo, J. H. (2020) · Progress in Materials Science · doi:10.1016/j.pmatsci.2020.100638 · Cited by 531
Huang, Q., & Zhu, Y. (2019) · Advanced Materials Technologies · doi:10.1002/admt.201800546 · Cited by 482
Transparent Electronics for Wearable Electronics Application
Won, D., Bang, J., Choi, S. H., Pyun, K. R., Jeong, S., Lee, Y., & Ko, S. H. (2023) · Chemical Reviews · doi:10.1021/acs.chemrev.3c00139 · Cited by 339
Self-citationLiu, S., Yuen, M. C., White, E. L., Boley, J. W., Deng, B., Cheng, G. J., & Kramer-Bottiglio, R. (2018) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.8b08722 · Cited by 283
Metadata
- Authors
- Kwon, J., Cho, H., Eom, H., Lee, H., Suh, Y. D., Moon, H., Shin, J., Hong, S., & Ko, S. H.
- Venue
- ACS Applied Materials & Interfaces
- Publisher
- American Chemical Society (ACS)
- Published
- 2016-04-29
- Volume
- 8
- Issue
- 18
- Pages
- 11575-11582
- ISSN
- 1944-8244 (ISSN-L)
- 1944-8252
- OpenAlex
- W2342562666
- Cited by
- 199
- References
- 1
- FWCI
- 11.74
- Type
- journal article
- Language
- en
- Open access
- closed
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