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Nanoporous Si as an Efficient Thermoelectric Material
Abstract
Room-temperature thermoelectric properties of n-type crystalline Si with periodically arranged nanometer-sized pores are computed using a combination of classical molecular dynamics for lattice thermal conductivity and ab initio density functional theory for electrical conductivity, Seebeck coefficient, and electronic contribution to the thermal conductivity. The electrical conductivity is found to decrease by a factor of 2-4, depending on doping levels, compared to that of bulk due to confinement. The Seebeck coefficient S yields a 2-fold increase for carrier concentrations less than 2 x 10(19) cm(-3), above which S remains closer to the bulk value. Combining these results with our calculations of lattice thermal conductivity, we predict the figure of merit ZT to increase by 2 orders of magnitude over that of bulk. This enhancement is due to the combination of the nanometer size of pores which greatly reduces the thermal conductivity and the ordered arrangement of pores which allows for only a moderate reduction in the power factor. We find that while alignment of pores is necessary to preserve power factor values comparable to those of bulk Si, a symmetric arrangement is not required. These findings indicate that nanoporous semiconductors with aligned pores may be highly attractive materials for thermoelectric applications.
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Cites
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Fasano, M., Humplik, T., Bevilacqua, A., Tsapatsis, M., Chiavazzo, E., Wang, E. N., & Asinari, P. (2016) · Nature Communications · doi:10.1038/ncomms12762 · Cited by 123
Metadata
- Authors
- Lee, J.-H., Galli, G. A., & Grossman, J. C.
- Venue
- Nano Letters
- Publisher
- American Chemical Society (ACS)
- Published
- 2008-10-24
- Volume
- 8
- Issue
- 11
- Pages
- 3750-3754
- ISSN
- 1530-6984 (ISSN-L)
- 1530-6992
- OpenAlex
- W1994146818
- Cited by
- 296
- References
- 24
- FWCI
- 7.41
- Type
- journal article
- Language
- en
- Open access
- closed
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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
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