The DOI matches its Crossref record.
Electrochemical deposition of Copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features
Overview
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Integrity signals
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Statistics
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Claims the paper makes
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Self-check
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Citations
Cited by
Water transport in polymer electrolyte membrane fuel cells
Jiao, K., & Li, X. (2011) · Progress in Energy and Combustion Science · doi:10.1016/j.pecs.2010.06.002 · Cited by 1,086
Asensio, J. A., Sánchez, E. M., & Gómez-Romero, P. (2010) · Chemical Society Reviews · doi:10.1039/b922650h · Cited by 746
The CO Poisoning Effect in PEMFCs Operational at Temperatures up to 200°C
Li, Q., He, R., Gao, J.-A., Jensen, J. O., & Bjerrum, N. J. (2003) · Journal of The Electrochemical Society · doi:10.1149/1.1619984 · Cited by 586
Metadata
- Authors
- Li, W. H., Ye, J. H., & Li, S. F. Y.
- Venue
- Journal of Applied Electrochemistry
- Published
- 2001-12
- Volume
- 31
- Issue
- 12
- Pages
- 1395-1397
- ISSN
- 0021-891X (ISSN-L)
- 1572-8838
- OpenAlex
- W2003269425
- Cited by
- 185
- References
- 0
- FWCI
- 2.67
- Type
- journal article
- Language
- en
- Open access
- closed
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
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How to cite
Cite CoChat for the checks on this page, and the paper for its own findings.
- This page
- CoChat. (2026). Citation check: Electrochemical deposition of Copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features. https://app.cochat.ai/papers/10.1023/a:1013872107905
- The paper
- Li, W. H., Ye, J. H., & Li, S. F. Y. (2001). Electrochemical deposition of Copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features. Journal of Applied Electrochemistry. https://doi.org/10.1023/a%3A1013872107905
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
