The DOI matches its Crossref record; 17 of the 17 references it cites were found in a registry or an index.
3D-printed microelectronics for integrated circuitry and passive wireless sensors
Open accessAbstract
Three-dimensional (3D) additive manufacturing techniques have been utilized to make 3D electrical components, such as resistors, capacitors, and inductors, as well as circuits and passive wireless sensors. Using the fused deposition modeling technology and a multiple-nozzle system with a printing resolution of 30 μm, 3D structures with both supporting and sacrificial structures are constructed. After removing the sacrificial materials, suspensions with silver particles are injected subsequently solidified to form metallic elements/interconnects. The prototype results show good characteristics of fabricated 3D microelectronics components, including an inductor–capacitor-resonant tank circuitry with a resonance frequency at 0.53 GHz. A 3D “smart cap” with an embedded inductor–capacitor tank as the wireless passive sensor was demonstrated to monitor the quality of liquid food (e.g., milk and juice) wirelessly. The result shows a 4.3% resonance frequency shift from milk stored in the room temperature environment for 36 h. This work establishes an innovative approach to construct arbitrary 3D systems with embedded electrical structures as integrated circuitry for various applications, including the demonstrated passive wireless sensors.
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Cites
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Cited by
The current application of nanotechnology in food and agriculture
He, X., Deng, H., & Hwang, H.-M. (2019) · Journal of Food and Drug Analysis · doi:10.1016/j.jfda.2018.12.002 · Cited by 959
Disposable Sensors in Diagnostics, Food, and Environmental Monitoring
Dincer, C., Bruch, R., Costa‐Rama, E., Fernández‐Abedul, M. T., Merkoçi, A., Manz, A., Urban, G. A., & Güder, F. (2019) · Advanced Materials · doi:10.1002/adma.201806739 · Cited by 955
Conductive nanomaterials for 2D and 3D printed flexible electronics
Kamyshny, A., & Magdassi, S. (2019) · Chemical Society Reviews · doi:10.1039/c8cs00738a · Cited by 469
The Boom in 3D-Printed Sensor Technology
Xu, Y., Wu, X., Guo, X., Kong, B., Zhang, M., Qian, X., Mi, S., & Sun, W. (2017) · Sensors · doi:10.3390/s17051166 · Cited by 361
3D printing technologies: techniques, materials, and post-processing
Karakurt, I., & Lin, L. (2020) · Current Opinion in Chemical Engineering · doi:10.1016/j.coche.2020.04.001 · Cited by 346
Self-citation
Metadata
- Authors
- Wu, S.-Y., Yang, C., Hsu, W., & Lin, L.
- Venue
- Microsystems & Nanoengineering
- Published
- 2015-07-20
- Volume
- 1
- Issue
- 1
- ISSN
- 2055-7434 (ISSN-L)
- OpenAlex
- W2227388478
- Cited by
- 285
- References
- 17
- FWCI
- 35.51
- Type
- journal article
- Language
- en
- Open access
- gold
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Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
