Effects of chemical bonding on heat transport across interfaces
Open accessAbstract
Interfaces often dictate heat flow in micro- and nanostructured systems. However, despite the growing importance of thermal management in micro- and nanoscale devices, a unified understanding of the atomic-scale structural features contributing to interfacial heat transport does not exist. Herein, we experimentally demonstrate a link between interfacial bonding character and thermal conductance at the atomic level. Our experimental system consists of a gold film transfer-printed to a self-assembled monolayer (SAM) with systematically varied termination chemistries. Using a combination of ultrafast pump-probe techniques (time-domain thermoreflectance, TDTR, and picosecond acoustics) and laser spallation experiments, we independently measure and correlate changes in bonding strength and heat flow at the gold-SAM interface. For example, we experimentally demonstrate that varying the density of covalent bonds within this single bonding layer modulates both interfacial stiffness and interfacial thermal conductance. We believe that this experimental system will enable future quantification of other interfacial phenomena and will be a critical tool to stimulate and validate new theories describing the mechanisms of interfacial heat transport. Ultimately, these findings will impact applications, including thermoelectric energy harvesting, microelectronics cooling, and spatial targeting for hyperthermal therapeutics.
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TDTR has been frequently used to measure the heat capacity of new materials and the thermal conductance of various solid/solid interfaces.
“The heat capacity of new materials 38, 39 and thermal conductance of various solid/solid interfaces 40-47 have also been frequently measured using TDTR.”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [47]
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References 33 · Cited by 701
Research works printed but not linked: 8
- Losego, M. D., Moh, L., Arpin, K. A., Cahill, D. G. & Braun, P. V. Interfacial thermal conductance in spun-cast polymer films and polymer brushes. Appl. Phys. Lett. 97, 011908 (2010).
- Hung, M. T., Choi, O., Ju, Y. S. & Hahn, H. T. Heat conduction in graphite- nanoplatelet-reinforced polymer nanocomposites. Appl. Phys. Lett. 89, 023117 (2006).
- Hopkins, P. E., Phinney, L. M., Serrano, J. R. & Beechem, T. E. Effects of surface roughness and oxide layer on the thermal boundary conductance at aluminum/silicon interfaces. Phys. Rev. B 82, 085307 (2010).
- Hu, L. et al. Phonon interference at self-assembled monolayer interfaces: Molecular dynamics simulations. Phys. Rev. B 81, 235427 (2010).
- Shenogina, N., Godawat, R., Keblinski, P. & Garde, S. How Wetting and Adhesion Affect Thermal Conductance of a Range of Hydrophobic to Hydrophilic Aqueous Interfaces. Phys. Rev. Lett. 102, 156101 (2009).
- Hu, M., Keblinski, P. & Schelling, P. K. Kapitza conductance of silicon-amorphous polyethylene interfaces by molecular dynamics simulations. Phys. Rev. B 79, 104305 (2009).
- Prasher, R. Acoustic mismatch model for thermal contact resistance of van der Waals contacts. Appl. Phys. Lett. 94, 041905 (2009).
- Wang, R. Y., Segalman, R. A. & Majumdar, A. Room temperature thermal conductance of alkanedithiol self-assembled monolayers. Appl. Phys. Lett. 89, 173113 (2006).
- Authors
- Losego, M. D., Grady, M. E., Sottos, N. R., Cahill, D. G., & Braun, P. V.
- Affiliations
- University of Illinois Urbana-Champaign (US)
- Corresponding author
- Losego, Mark D.
- Venue
- Nature Materials
- Published
- 2012-04-22
- Volume
- 11
- Issue
- 6
- Pages
- 502-506
- ISSN
- 1476-1122 (ISSN-L)
- 1476-4660
- OpenAlex
- W2058274078
- Cited by
- 701
- References
- 33
- Citations by year
- 2026: 38 · 2025: 49 · 2024: 53 · 2023: 54 · 2022: 44 · 2021: 51 · 2020: 66 · 2019: 52 · 2018: 49 · 2017: 46 · 2016: 62 · 2015: 49 · 2014: 43 · 2013: 38 · 2012: 6
- FWCI
- 20.01
- Type
- journal article
- Language
- en
- Open access
- green
- www.osti.gov
- Locations
- Nature Materials (publishedVersion)
- PubMed (publishedVersion)
- OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) (submittedVersion)
- Funders
- National Science Foundation (DE-FG02-07ER46453, DE-FG02-07ER46471, 0726742)
- U.S. Department of Energy (DEFG0207ER46471, DEFG0207ER46453)
- University of Illinois at Urbana-Champaign
- Multidisciplinary University Research Initiative (FA9550-08-1-0407)
- Division of Materials Research
- Division of Civil, Mechanical and Manufacturing Innovation
- Air Force Office of Scientific Research (FA9550-, MURI FA9550-08-1-0407, FA9550-08-1–0407)
- Topics
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Physical Sciences › Engineering › Civil and Structural Engineering › Thermal Radiation and Cooling Technologies
- Physical Sciences › Engineering › Mechanics of Materials › Thermoelastic and Magnetoelastic Phenomena
- Keywords
- interfacial heat transfer, thermal conductance, chemical bonding, gold films, self-assembled monolayers, interfacial stiffness, time-domain thermoreflectance, picosecond acoustics, laser spallation, thermal management, microelectronics cooling, thermoelectric energy harvesting
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