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Cited by 308

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Inkjet-printed silver tracks: low temperature curing and thermal stability investigation

Perelaer, By Jolke, de Laat, Antonius W. M., Hendriks, Chris E., Schubert, Ulrich S.·2008·Journal of Materials Chemistry

Abstract

In this contribution the curing behavior and conductivity development of several commercially available silver inks is discussed. In addition, the preparation and characterization of a silver particle ink that shows a curing temperature as low as 80 °C is described. Good to excellent conductivity values of 5 to 56% of bulk silver have been reached by using a very small amount of organic additives without any strong adsorbing groups such as amines, amides or mercapto groups. This low curing temperature opens new routes to produce conductive features on polymeric foils that have a low Tg, like PET. Furthermore, the temperature stability of silver tracks, prepared by inkjet printing different colloidal silver suspensions, was investigated. Hereto, the resistance was on-line measured during heating of the silver tracks, from room temperature to 650 °C.

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Metadata

Authors
Perelaer, B. J., de Laat, A. W. M., Hendriks, C. E., & Schubert, U. S.
Venue
Journal of Materials Chemistry
Published
2008
Volume
18
Issue
27
Pages
3209
ISSN
  • 0959-9428 (ISSN-L)
  • 1364-5501
OpenAlex
W2152516856
Cited by
308
References
0
FWCI
15.54
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: Inkjet-printed silver tracks: low temperature curing and thermal stability investigation. https://app.cochat.ai/papers/10.1039/b720032c
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Perelaer, B. J., de Laat, A. W. M., Hendriks, C. E., & Schubert, U. S. (2008). Inkjet-printed silver tracks: low temperature curing and thermal stability investigation. Journal of Materials Chemistry. https://doi.org/10.1039/b720032c

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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.