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Thermal transport and grain boundary conductance in ultrananocrystalline diamond thin films
Open accessAbstract
Although diamond has the highest known room temperature thermal conductivity, k∼2200W∕mK, highly sp3 amorphous carbon films have k<15W∕mK. We carry out an integrated experimental and simulation study of thermal transport in ultrananocrystalline diamond (UNCD) films. The experiments show that UNCD films with a grain size of 3–5nm have thermal conductivities as high as k=12W∕mK at room temperature, comparable with that of the most conductive amorphous diamond films. This value corresponds to a grain boundary (Kapitza) conductance greater than 3000MW∕m2K, which is ten times larger than that previously seen in any material. Our simulations of both UNCD and individual diamond grain boundaries yield values for the grain boundary conductance consistent with the experimentally obtained value, leading us to conclude that thermal transport in UNCD is controlled by the intrinsic properties of the grain boundaries.
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Cites
Thermal conductivity of amorphous solids above the plateau
Cahill, D. G., & Pohl, R. O. (1987) · Physical Review B · doi:10.1103/physrevb.35.4067 · Cited by 813
Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures
Cahill, D. G., Goodson, K., & Majumdar, A. (2002) · Journal of Heat Transfer · doi:10.1115/1.1454111 · Cited by 611
Cited by
Thermal properties of graphene and nanostructured carbon materials
Balandin, A. A. (2011) · Nature Materials · doi:10.1038/nmat3064 · Cited by 6,244
Bagri, A., Kim, S.-P., Ruoff, R. S., & Shenoy, V. B. (2011) · Nano Letters · doi:10.1021/nl202118d · Cited by 349
Paul, R., Du, F., Dai, L., Ding, Y., Wang, Z. L., Wei, F., & Roy, A. (2019) · Advanced Materials · doi:10.1002/adma.201805598 · Cited by 313
Dong, H., Wen, B., & Melnik, R. (2014) · Scientific Reports · doi:10.1038/srep07037 · Cited by 228
Metadata
- Authors
- Angadi, M. A., Watanabe, T., Bodapati, A., Xiao, X., Auciello, O., Carlisle, J. A., Eastman, J. A., Keblinski, P., Schelling, P. K., & Phillpot, S. R.
- Venue
- Journal of Applied Physics
- Publisher
- AIP Publishing
- Published
- 2006-06-01
- Volume
- 99
- Issue
- 11
- ISSN
- 0021-8979 (ISSN-L)
- 1089-7550
- OpenAlex
- W2017015578
- Cited by
- 165
- References
- 2
- FWCI
- 5.21
- Type
- journal article
- Language
- en
- Open access
- green
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- Angadi, M. A., Watanabe, T., Bodapati, A., Xiao, X., Auciello, O., Carlisle, J. A., Eastman, J. A., Keblinski, P., Schelling, P. K., & Phillpot, S. R. (2006). Thermal transport and grain boundary conductance in ultrananocrystalline diamond thin films. Journal of Applied Physics. https://doi.org/10.1063/1.2199974
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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
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