The DOI matches its Crossref record.
High figures of merit and natural nanostructures in Mg2Si0.4Sn0.6 based thermoelectric materials
Abstract
Mg 2 ( Si , Sn ) compounds have shown great promise for thermoelectric applications due to good thermoelectric properties, nontoxicity, and abundantly available constituent elements. Herein we report on the thermoelectric properties and microstructure of high performance Mg2Si0.4−xSn0.6Sbx (0⩽x⩽0.015) alloys. The state-of-the-art ZT value of ∼1.1 has been attained in the samples with x=0.0075 due to the relatively low thermal conductivity. In light of the simple cubic structure and mostly light constituent elements, the reduction in lattice thermal conductivity has been discussed in connection with a fairly large amount of in situ formed nanostructures in these samples.
Overview
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Self-check
Percentages, sums and reported differences re-computed from the paper’s own numbers.
The self-check needs the paper’s full text.
Citations
Cited by
Thermal conductivity of bulk and nanowire Mg2SixSn1−xalloys from first principles
Li, W., Lindsay, L., Broido, D. A., Stewart, D. A., & Mingo, N. (2012) · Physical Review B · doi:10.1103/physrevb.86.174307 · Cited by 616
Recent advances in high-performance bulk thermoelectric materials
Shi, X., Chen, L., & Uher, C. (2016) · International Materials Reviews · doi:10.1080/09506608.2016.1183075 · Cited by 494
First Principles Peierls-Boltzmann Phonon Thermal Transport: A Topical Review
Lindsay, L. (2016) · Nanoscale and Microscale Thermophysical Engineering · doi:10.1080/15567265.2016.1218576 · Cited by 129
Metadata
- Authors
- Zhang, Q., He, J., Zhu, T. J., Zhang, S. N., Zhao, X. B., & Tritt, T. M.
- Venue
- Applied Physics Letters
- Publisher
- AIP Publishing
- Published
- 2008-09-08
- Volume
- 93
- Issue
- 10
- ISSN
- 0003-6951 (ISSN-L)
- 1077-3118
- OpenAlex
- W1489502353
- Cited by
- 273
- References
- 0
- FWCI
- 5.05
- Type
- journal article
- Language
- en
- Open access
- closed
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
How to cite
Cite CoChat for the checks on this page, and the paper for its own findings.
- This page
- CoChat. (2026). Citation check: High figures of merit and natural nanostructures in Mg2Si0.4Sn0.6 based thermoelectric materials. https://app.cochat.ai/papers/10.1063/1.2981516
- The paper
- Zhang, Q., He, J., Zhu, T. J., Zhang, S. N., Zhao, X. B., & Tritt, T. M. (2008). High figures of merit and natural nanostructures in Mg2Si0.4Sn0.6 based thermoelectric materials. Applied Physics Letters. https://doi.org/10.1063/1.2981516
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
