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Cited by 124Heat Transfer and OptimizationHeat Transfer and Boiling StudiesHeat Transfer and Numerical Methods

The DOI matches its Crossref record; 38 of the 38 references it cites were found in a registry or an index.

Liquid Cooled Cold Plates for Industrial High-Power Electronic Devices—Thermal Design and Manufacturing Considerations

Kandlikar, Satish G., Hayner, Clifford N.·2009·Heat Transfer Engineering
DOI 10.1080/01457630902837343
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Abstract

Electronics cooling research has been largely focused on high heat flux removal from computer chips in the recent years. However, the equally important field of high-power electronic devices has been experiencing a major paradigm shift from air cooling to liquid cooling over the last decade. For example, multiple 250-W insulated-gate bipolar transistors used in a power drive for a 7000-HP motor used in pumping or in locomotive traction devices would not be sufficiently cooled with air-cooling techniques. Another example is a “hockey puck” SCR of 63 mm diameter used to drive an electric motor that could dissipate over 1500 W and is difficult to cool with air because of the shape of the device. Other devices include radio-frequency generators, industrial battery chargers, printing press thermal and humidity control equipment, traction devices, mining devices, crude oil extraction equipment, magnetic resonance imaging, and railroad engines. This article classifies the cold plates into four types: formed tube cold plate, deep drilled cold plate, machined channel cold plate, and pocketed folded-fin cold plate. The article further discusses selection of cold plate type and channel configuration, and some of the relevant manufacturing issues. It is recommended that the thermal designer be involved in the early stages during the electrical design and layout of the devices.

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Crossref · 10.1080/01457630902837343

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38 of 38 references verified0 citation errors · 0 not checkable

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Citations

Cites

Show all 38 references

Research works printed but not linked: 7

  1. Sathe S. B., 1994, ASME (HTS) Heat Transfer in Electronic Systems, 292, 123
  2. Bar-Cohen A., 1999, Wiley Series in Thermal Management of Microelectronic and Electronic Systems
  3. Romero, G. and Martinez, J. Development of Metal Matrix Composite Baseplate Technology for High Current Power Modules. Proc. International Symposium on Microelectronics. pp.421–426.
  4. Rodriguez, P. and Fusaro, J. Integration of Heat Exchanger with High Current Hybrid Power Module. Proc. Advances in Electronics Packaging Pacific Rim/ASME International Electronic Photon Packaging Conference—InterPak1997. vol. EEP-19-2, pp.2173–2178.
  5. Loosen, P. 2000. High-Power Diode Lasers: Fundamentals, Technology, Applications, Topics in Applied Physics , 289–301. Berlin, Germany: Springer Verlag.
  6. Mitic, G., Kiffe, W., Lefranc, G., Ramminger, S., Tilton, D. E., Smetana, B. A. and Weir, T. D. Spray Cooling of IGBT Electronic Power Modules. THERMES 2002 International Conference, Thermal Challenges in Next Generation Electronic Systems. pp.147–153.
  7. Bhunia A., 2005, Proceedings of the ASME Summer Heat Transfer Conference 2005, 4, 561

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Metadata

Authors
Kandlikar, S. G., & Hayner, C. N.
Affiliations
Rochester Institute of Technology (US)
ORCID
Kandlikar, Satish G.
Venue
Heat Transfer Engineering
Publisher
Informa UK Limited
Published
2009-10
Volume
30
Issue
12
Pages
918-930
ISSN
  • 0145-7632 (ISSN-L)
  • 1521-0537
DOI
10.1080/01457630902837343
OpenAlex
W2011185074
Cited by
124
References
38
Citations by year
2026: 11 · 2025: 7 · 2024: 11 · 2023: 16 · 2022: 8 · 2021: 21 · 2020: 8 · 2019: 11 · 2018: 6 · 2017: 9 · 2016: 3 · 2015: 4 · 2014: 3 · 2013: 2 · 2012: 2
FWCI
2.67
Type
journal article
Language
en
Open access
closed
Locations
Heat Transfer Engineering (publishedVersion)
Topics
  • Physical Sciences › Engineering › Mechanical Engineering › Heat Transfer and Optimization
  • Physical Sciences › Engineering › Mechanical Engineering › Heat Transfer and Boiling Studies
  • Physical Sciences › Engineering › Computational Mechanics › Heat Transfer and Numerical Methods
Keywords
high-power electronic devices, electronics cooling, IGBT, thyristors, power electronics thermal management, channel configuration, thermal design, traction drives

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