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Measurement of thermal diffusivity with a modified Angstrom method
Open accessAbstract
A methodology has been developed to measure the thermal diffusivity of high thermal conductivity solid materials. The basic idea traces back to the Ångström method, but the implementation differs in some points. Originally the specimen was free to the environment, here the specimen is thermally insulated to reduce, and control, the effects of natural convection. An appropriate analytical solution is used to calculate temperature distribution. The original two-point approach is replaced by a parameter estimation technique to consider multiple measurement points and reduce the final uncertainty. The methodology is used for a pure copper bar. The results are compared with the data available in the literature. The measured thermal diffusivity is 1.16±0.07·10−4 m2/s while the most reliable data available in the literature is 1.17±0.04·10−4 m2/s. The agreement of the present value with those available in the literature is excellent. This makes the use of this simple analytical approach attractive.
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The absorbed heat primarily gets conducted downward into the Cu substrate due to Cu's high thermal conductivity (kCu ≈ 400 W/mK) and diffusivity (αCu ≈ 111 mm2/s).
“The absorbed heat primarily gets conducted downward into the Cu substrate due to Cu's high thermal conductivity (kCu ≈ 400 W/mK) and diffusivity (αCu ≈ 111 mm²/s) [34].”
From Effect of nickel interlayer thickness on intermetallic compound formation and interfacial integrity in pulsed laser welding of aluminum and copper (2026) · cites this paper as [34]
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Singh, R., Arora, N., & Choudhary, A. (2026) · Welding in the World · doi:10.1007/s40194-026-02375-5 · Cited by 6
Metadata
- Authors
- Piva, S.
- Affiliations
- University of Ferrara (IT)
- Corresponding author
- Piva, S
- Venue
- Journal of Physics: Conference Series
- Publisher
- IOP Publishing
- Published
- 2025-01-01
- Volume
- 2940
- Issue
- 1
- Pages
- 012014
- ISSN
- 1742-6588 (ISSN-L)
- 1742-6596
- OpenAlex
- W4406902827
- Cited by
- 3
- References
- 0
- Citations by year
- 2026: 2 · 2025: 1
- FWCI
- 2.89
- Type
- conference paper
- Language
- en
- Open access
- diamond
- doi.org
- Licence
- Locations
- Journal of Physics Conference Series (publishedVersion, cc-by)
- Institutional Research Information System University of Ferrara (University of Ferrara) (submittedVersion, cc-by)
- Topics
- Physical Sciences › Engineering › Computational Mechanics › Heat Transfer and Numerical Methods
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Physical Sciences › Engineering › Mechanics of Materials › Thermography and Photoacoustic Techniques
- Keywords
- thermal diffusivity measurement, Angstrom method, thermal insulation, temperature distribution, parameter estimation, measurement uncertainty reduction, copper
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