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Cited by 198

The DOI matches its Crossref record; 1 of the 1 references it cites were found in a registry or an index.

Peeling from a biomimetically patterned thin elastic film

Open access
Ghatak, Animangsu, Mahadevan, L., Chung, Jun Young, Chaudhury, Manoj K., Shenoy, Vijay·2004·Proceedings of the Royal Society of London. Series A: Mathematical, Physical and Engineering Sciences

Abstract

Inspired by the observation that many naturally occurring adhesives arise as textured thin films, we consider the displacement–controlled peeling of a flexible plate from an incision–patterned thin adhesive elastic layer. We find that crack initiation from an incision on the film occurs at a load much higher than that required to propagate it on a smooth adhesive surface; multiple incisions thus cause the crack to propagate intermittently. Microscopically, this mode of crack initiation and propagation in geometrically confined thin adhesive films is related to the nucleation of cavitation bubbles behind the incision which must grow and coalesce before a viable crack propagates. Our theoretical analysis allows us to rationalize these experimental observations qualitatively and quantitatively and suggests a simple design criterion for increasing the interfacial fracture toughness of adhesive films.

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Metadata

Authors
Ghatak, A., Mahadevan, L., Chung, J. Y., Chaudhury, M. K., & Shenoy, V.
Venue
Proceedings of the Royal Society of London. Series A: Mathematical, Physical and Engineering Sciences
Published
2004-09-08
Volume
460
Issue
2049
Pages
2725-2735
ISSN
  • 1364-5021 (ISSN-L)
  • 1471-2946
OpenAlex
W2156707927
Cited by
198
References
1
FWCI
19.66
Type
journal article
Language
en
Open access
green

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CoChat. (2026). Citation check: Peeling from a biomimetically patterned thin elastic film. https://app.cochat.ai/papers/10.1098/rspa.2004.1313
The paper
Ghatak, A., Mahadevan, L., Chung, J. Y., Chaudhury, M. K., & Shenoy, V. (2004). Peeling from a biomimetically patterned thin elastic film. Proceedings of the Royal Society of London. Series A: Mathematical, Physical and Engineering Sciences. https://doi.org/10.1098/rspa.2004.1313

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