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Thermal Analysis of a Skull Implant in Brain-Computer Interfaces
Open accessAbstract
The goal of this study is to estimate the thermal impact of a titanium skull unit (SU) implanted on the exterior aspect of the human skull. We envision this unit to house the front-end of a fully implantable electrocorticogram (ECoG)-based bi-directional (BD) brain-computer interface (BCI). Starting from the bio-heat transfer equation with physiologically and anatomically constrained tissue parameters, we used the finite element method (FEM) implemented in COMSOL to build a computational model of the SU's thermal impact. Based on our simulations, we predicted that the SU could consume up to 75 mW of power without raising the temperature of surrounding tissues above the safe limits (increase in temperature of 1°C). This power budget by far exceeds the power consumption of our front-end prototypes, suggesting that this design can sustain the SU's ability to record ECoG signals and deliver cortical stimulation. These predictions will be used to further refine the existing SU design and inform the design of future SU prototypes.
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Simulations indicated that the skull unit implant could operate at a maximum power of 75 mW without causing adjacent tissue temperature to exceed the safety threshold.
“Simulations from another study indicated that the skull unit (SU) implant could operate at a maximum power of 75 mW without causing the temperature of the adjacent tissues to exceed the established safety threshold (Serrano-Amenos et al., 2020).”
From Comparative analysis of energy transfer mechanisms for neural implants (2024) · cites this paper as Serrano-Amenos et al., 2020
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References 24 · Cited by 14
Research works printed but not linked: 22
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- kim, 2007, Thermal Impact of an Active 3-D Microelectrode Array Implanted in the Brain, IEEE T Neur Sys Reh, 15, 493, 10.1109/TNSRE.2007.908429 · DOI
- wolf, 2019, Chapter 3 Thermal Considerations for the Design of an Implanted Cortical Brain – Machine Interface ( BMI ), 1
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- 10.1038/s41582-018-0128-2 · DOI
- 10.1109/TBCAS.2017.2723607 · DOI
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- 10.1109/TBCAS.2019.2963302 · DOI
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- hasgall, 2018, IT’IS Database for Thermal and Electromagnetic Parameters of Biological Tissues
- davies, 1994, Adaptation of Tissue to a Chronic Heat Load, ASAIO Journal, 40, 514m, 10.1097/00002480-199407000-00053 · DOI
Metadata
- Authors
- Serrano-Amenos, C., Hu, F., Wang, P. T., Kellis, S., Andersen, R. A., Liu, C. Y., Heydari, P., Do, A. H., & Nenadic, Z.
- Affiliations
- University of California, Irvine (US)
- California Institute of Technology (US)
- University of Southern California (US)
- ORCID
- Venue
- 2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)
- Publisher
- IEEE
- Published
- 2020-07
- Volume
- 2020
- Pages
- 3066-3069
- ISSN
- 2375-7477 (ISSN-L)
- OpenAlex
- W3082907137
- Cited by
- 14
- References
- 24
- Citations by year
- 2025: 6 · 2024: 2 · 2023: 2 · 2022: 2 · 2021: 1 · 2020: 1
- FWCI
- 5.70
- Type
- conference paper
- Language
- en
- Open access
- green
- escholarship.org
- Licence
- Locations
- Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) (publishedVersion)
- PubMed (publishedVersion)
- CaltechAUTHORS (California Institute of Technology) (submittedVersion)
- eScholarship (California Digital Library) (submittedVersion, cc-by)
- Topics
- Life Sciences › Neuroscience › Cellular and Molecular Neuroscience › Neuroscience and Neural Engineering
- Life Sciences › Neuroscience › Cognitive Neuroscience › EEG and Brain-Computer Interfaces
- Physical Sciences › Engineering › Biomedical Engineering › Wireless Body Area Networks
- Keywords
- skull implants, brain-computer interface, electrocorticography, titanium implants, thermal analysis, bioheat transfer, cortical stimulation, implant design
- MeSH terms
- Electrocorticography, Hot Temperature, Humans, Skull, Prostheses and Implants, Brain-Computer Interfaces
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