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Characterization of Intermetallic Compounds in Al-Cu-Bimetallic Interfaces
Abstract
Intermetallic compounds (IMC) resulting from interdiffusion processes at bimetal joints or coated metals usually have worse electrical and mechanical properties compared to the pure metals (e.g. higher specific electric resistance, high brittleness). For a better understanding of the aging of Al-Cu bimetallic joints by interdiffusion, an extensive characterization of the IMC's physical properties is necessary. For that purpose, phase-pure samples of three phases (AlCu, Al2Cu and Al4Cu9) have been prepared by different processes such as physical vapor deposition or electrochemical deposition. The transition from ductile to brittle behavior complicates the mechanical handling of the samples and some phases could not be prepared in pure form, yet. By adjusting and optimizing the manufacturing processes and the development of a suitable experimental setup, first results for the characterization of IMC's electrical properties were obtained. Established values for the specific electric resistance of the phase AlCu could not be confirmed. In a further step, the so far poorly studied temperature coefficient of resistivity of each IMP will be determined.
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“Pfeifer et al. [39] have measured the resistance of individual Al x Cu y intermetallic compounds, and shown they can be up to 11 times the resistivity of copper.”
From Electrical and thermal stability of Al-Cu welds: Performance benchmarking of the hybrid metal extrusion and bonding process (2022) · cites this paper as [39]
Citations
Cites
Preparation and Properties of Copper-Aluminum Intermetallic Compounds
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Elkjaer, A., Sørhaug, J. A., Ringen, G., Bjørge, R., & Grong, Ø. (2022) · Journal of Manufacturing Processes · doi:10.1016/j.jmapro.2022.04.029 · Cited by 23
Metadata
- Authors
- Pfeifer, S., Großmann, S., Freudenberger, R., Willing, H., & Kappl, H.
- Affiliations
- Institute of Electrical Power Systems and High Voltage Engineering (DE)
- Forschungsinstitut für Edelmetalle und Metallchemie (DE)
- Venue
- 2012 IEEE 58th Holm Conference on Electrical Contacts (Holm)
- Publisher
- IEEE
- Published
- 2012-09
- Pages
- 1-6
- OpenAlex
- W2050191207
- Cited by
- 30
- References
- 1
- Citations by year
- 2026: 3 · 2025: 4 · 2024: 5 · 2023: 1 · 2022: 3 · 2020: 3 · 2019: 3 · 2018: 2 · 2017: 1 · 2016: 1 · 2015: 1 · 2014: 3
- FWCI
- 1.63
- Type
- conference paper
- Language
- en
- Open access
- closed
- Locations
- IEEE Holm Conference on Electrical Contacts (HOLM) (publishedVersion)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
- Physical Sciences › Materials Science › Electronic, Optical and Magnetic Materials › Semiconductor materials and interfaces
- Keywords
- intermetallic compounds, interdiffusion, AlCu, Al2Cu, Al4Cu9, electrical resistivity, temperature coefficient of resistivity, ductile-to-brittle transition, physical vapor deposition, electrodeposition
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- CoChat. (2026). Citation check: Characterization of Intermetallic Compounds in Al-Cu-Bimetallic Interfaces. https://app.cochat.ai/papers/10.1109/holm.2012.6336554
- The paper
- Pfeifer, S., Großmann, S., Freudenberger, R., Willing, H., & Kappl, H. (2012). Characterization of Intermetallic Compounds in Al-Cu-Bimetallic Interfaces. 2012 IEEE 58th Holm Conference on Electrical Contacts (Holm). https://doi.org/10.1109/holm.2012.6336554
