Cited by 1

The DOI matches its Crossref record, with a small difference in title or year.

The power7TM processor SoC

Wendel, Dieter, Kalla, Ronald, Friedrich, Joshua, Kahle, James, Leenstra, Jens, Lichtenau, Cedric, Sinharoy, Balaram, Starke, William, Zyuban, Victor·2010·2010 IEEE International Conference on Integrated Circuit Design and Technology

Abstract

Introducing POWER7™ the latest member of the IBM POWER™ processor family. A 567 mm2chip implemented in 45nm SOI technology, holding eight quad threaded cores, a 32MB shared eDRAM L3, two memory controllers and high bandwidth SMP interfaces. The new out of order, shallow pipeline core with 12 execution units, multiport L1 caches and a private 256 kB L2 offers the efficiency to support 4× the number of cores within the same power envelope as its predecessor. Supporting over 4 GHz, the L1 data cache loop is kept to 2 cycles. Data from the L2 can be returned to the core at a rate of 32 B per cycle.

Overview

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Crossref · 10.1109/icicdt.2010.5510286

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  • Few years ago, CPUs had nearly 1B transistors; the recently announced Oracle SPARC M7 CPU will have more than 10B transistors on chip.

    “Few years ago, CPUs had nearly 1B transistors [Wendel et al. 2010] while the recently announced Oracle SPARC M7 CPU will have more than 10B transistors on chip [Morgan 2014].”

    From A Survey of CPU-GPU Heterogeneous Computing Techniques (2015) · cites this paper as Wendel et al. 2010

  • The 45nm POWER7 processor had 32MB eDRAM LLC, the 32nm POWER7+ had 80MB eDRAM LLC, and the 22nm POWER8 has 96MB eDRAM LLC.

    “The 45nm POWER7 processor had 32MB eDRAM (embedded DRAM) LLC [Wendel et al. 2010], the 32nm POWER7+ processor had an 80MB eDRAM LLC [Zyuban et al. 2013], while the 22nm POWER8 processor has a 96MB eDRAM LLC [Fluhr et al. 2014].”

    From A Survey of CPU-GPU Heterogeneous Computing Techniques (2015) · cites this paper as Wendel et al. 2010

Citations

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No references could be resolved yet.

Research works printed but not linked: 5

  1. pille, 0, A 32kB 2R/1 W L1 Data Cache in 45nm SOI Technology for the POWER7™ Processor, ISSCC 2010
  2. 10.1109/ISSCC.2010.5434074 · DOI
  3. barth, 0, A 45nm SOI Embedded Dram macro for the POWER7™ Processor 32MByte On-Chip L3 Cache, ISSCC 2010
  4. starke, 2009, POWER7™ Design, Hot Chips
  5. kalla, 2009, POWER7™, Hot Chips

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Metadata

Authors
Wendel, D., Kalla, R., Friedrich, J., Kahle, J., Leenstra, J., Lichtenau, C., Sinharoy, B., Starke, W., & Zyuban, V.
Venue
2010 IEEE International Conference on Integrated Circuit Design and Technology
Publisher
IEEE
Published
2010-06
Pages
71-73
Cited by
0
References
0

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