Cited by 1,225Nanomaterials and Printing TechnologiesNanofabrication and Lithography TechniquesElectronic Packaging and Soldering Technologies

Technologies for Printing Sensors and Electronics Over Large Flexible Substrates: A Review

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Khan, Saleem, Lorenzelli, Leandro, Dahiya, Ravinder S.·2015·IEEE Sensors Journal

Abstract

Printing sensors and electronics over flexible substrates are an area of significant interest due to low-cost fabrication and possibility of obtaining multifunctional electronics over large areas. Over the years, a number of printing technologies have been developed to pattern a wide range of electronic materials on diverse substrates. As further expansion of printed technologies is expected in future for sensors and electronics, it is opportune to review the common features, the complementarities, and the challenges associated with various printing technologies. This paper presents a comprehensive review of various printing technologies, commonly used substrates and electronic materials. Various solution/dry printing and contact/noncontact printing technologies have been assessed on the basis of technological, materials, and process-related developments in the field. Critical challenges in various printing techniques and potential research directions have been highlighted. Possibilities of merging various printing methodologies have been explored to extend the lab developed standalone systems to high-speed roll-to-roll production lines for system level integration.

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Crossref · 10.1109/jsen.2014.2375203

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References 166 · Cited by 1,225

Authors
Khan, S., Lorenzelli, L., & Dahiya, R. S.
Affiliations
  • University of Trento (IT)
  • University of Glasgow (GB)
Venue
IEEE Sensors Journal
Published
2015-06
Volume
15
Issue
6
Pages
3164-3185
ISSN
  • 1530-437X (ISSN-L)
  • 1558-1748
OpenAlex
W2044479329
Cited by
1,225
References
166
Citations by year
2026: 51 · 2025: 77 · 2024: 88 · 2023: 110 · 2022: 114 · 2021: 169 · 2020: 147 · 2019: 151 · 2018: 134 · 2017: 86 · 2016: 69 · 2015: 27 · 2014: 1
FWCI
32.41
Type
journal article
Language
en
Open access
Locations
  • IEEE Sensors Journal (publishedVersion, cc-by)
  • ENLIGHTEN (Jurnal Bimbingan dan Konseling Islam) (acceptedVersion)
Funders
  • Engineering and Physical Sciences Research Council (EPSRC) through the Fellowship for Growth-Printable Tactile Skin (EP/M002527/1)
  • European Commission (PITN-GA-2012-317488-CONTEST)
  • EPSRC-Flexible Electronic Device Modelling (EP/M002519/1)
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Nanomaterials and Printing Technologies
  • Physical Sciences › Engineering › Biomedical Engineering › Nanofabrication and Lithography Techniques
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
Keywords
printed electronics, printed sensors, flexible substrates, roll-to-roll printing, contact printing, electronic materials, large-area electronics, system integration, low-cost fabrication

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