Cited by 30Parallel Computing and Optimization Techniques3D IC and TSV technologiesAdvanced Database Systems and Queries

Processing data where it makes sense in modern computing systems: Enabling in-memory computation

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Mutlu, Onur·2018·2018 7th Mediterranean Conference on Embedded Computing (MECO)

Abstract

Today's systems are overwhelmingly designed to move data to computation. This design choice goes directly against at least three key trends in systems that cause performance, scalability and energy bottlenecks: 1) data access from memory is already a key bottleneck as applications become more data-intensive and memory bandwidth and energy do not scale well, 2) energy consumption is a key constraint in especially mobile and server systems, 3) data movement is very expensive in terms of bandwidth, energy and latency, much more so than computation. These trends are especially severely-felt in the data-intensive server and energy-constrained mobile systems of today. At the same time, conventional memory technology is facing many scaling challenges in terms of reliability, energy, and performance [1-23]. As a result, memory system architects are open to organizing memory in different ways and making it more intelligent, at the expense of slightly higher cost. The emergence of 3D-stacked memory plus logic as well as the adoption of error correcting codes inside the latest DRAM chips are an evidence of this trend. In this talk, I will discuss some recent research that aims to practically enable computation close to data. After motivating trends in applications as well as technology, we will discuss at least two promising directions: 1) performing massively-parallel bulk operations in memory by exploiting the analog operational properties of DRAM, with low-cost changes [24-28], 2) exploiting the logic layer in 3D-stacked memory technology in various ways to accelerate important data-intensive applications [28-36]. In both approaches, we will discuss relevant cross-layer research, design, and adoption challenges in devices, architecture, systems, and programming models. Our focus will be the development of in-memory processing designs that can be adopted in real computing platforms at low cost.

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Crossref · 10.1109/meco.2018.8405955

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1 of 1 references verified0 citation errors · 0 not checkable

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  • Data transfer from memory to processing units and vice versa imposes substantial energy and latency costs.

    “Considering limited memory response time and bandwidth, data transfer—from memory to processing units and vice versa—imposes substantial energy and latency (response delay) costs [41].”

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Authors
Mutlu, O.
Affiliations
ETH Zurich (CH)
Corresponding author
Mutlu, Onur
Venue
2018 7th Mediterranean Conference on Embedded Computing (MECO)
Publisher
IEEE
Published
2018-06
Pages
8-9
OpenAlex
W2868611809
Cited by
30
References
1
Citations by year
2026: 7 · 2025: 4 · 2024: 4 · 2023: 2 · 2022: 4 · 2021: 4 · 2020: 3 · 2019: 1 · 2018: 1
FWCI
1.93
Type
conference paper
Language
en
Open access
Locations
Mediterranean Conference on Embedded Computing (MECO) (publishedVersion)
Topics
  • Physical Sciences › Computer Science › Hardware and Architecture › Parallel Computing and Optimization Techniques
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › 3D IC and TSV technologies
  • Physical Sciences › Computer Science › Computer Networks and Communications › Advanced Database Systems and Queries
Keywords
in-memory computing, data movement bottleneck, DRAM, 3D stacked memory, energy efficiency, memory bandwidth, data-intensive applications, cross-layer design, programming models, mobile systems, server systems

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