Cited by 0Low-power high-performance VLSI designVLSI and FPGA Design TechniquesHeat Transfer and Numerical Methods

VSTherm: A Virtual Path-Based Stochastic Solver for Full-Chip Leakage-Aware Nonlinear Thermal Simulation

Meng, Yuan, Dong, Zhixuan, Wang, Yuyan, Yan, Changhao, Bi, Zhaori, Zhu, Keren, Wang, Sheng-Guo, Zhou, Dian +1 more·2026·IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Abstract

The continuous advancement of semiconductor processes has led to increasingly prominent leakage power issues in integrated circuits (ICs), making leakage-aware nonlinear thermal simulation a critical challenge in modern chip design. Traditional deterministic field solvers provide high accuracy but suffer from significant computational inefficiencies when handling large-scale mesh structures. Conversely, stochastic methods offer rapid computation speeds but are inherently limited to single-point solutions, preventing them from effectively addressing nonlinear thermal problems. To address this challenge, we propose a virtual path-based stochastic solver that enables efficient leakage-aware thermal simulation. The virtual path algorithm decomposes each real path in Brownian motion into virtual paths, extending stochastic solvers from single-point solutions to regional solutions, allowing a stochastic method to achieve full-chip thermal simulation for the first time, thus enabling the handling of nonlinearity. Additionally, we further accelerate the iteration process by reusing the path trajectories from the first solution process. Extensive experimental evaluations demonstrate that our method achieves a speedup of 20.17× to 52.23× compared to the state-of-the-art solver 3D-ICE on 4 GPUs across various scenarios while maintaining comparable accuracy.

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References 25

Authors
Meng, Y., Dong, Z., Wang, Y., Yan, C., Bi, Z., Zhu, K., Wang, S.-G., Zhou, D., & Zeng, X.
Affiliations
  • Fudan University (CN)
  • University of North Carolina at Charlotte (US)
Venue
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Published
2026-09
Volume
45
Issue
9
Pages
4464-4477
ISSN
  • 0278-0070 (ISSN-L)
  • 1937-4151
OpenAlex
W7123357368
Cited by
0
References
25
FWCI
0.00
Type
journal article
Language
en
Open access
closed
Locations
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (publishedVersion)
Funders
  • National Natural Science Foundation of China (NSFC) Research Projects (92473207)
  • Science and Technology Commission of Shanghai Municipality Project (24JD1400800)
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Low-power high-performance VLSI design
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › VLSI and FPGA Design Techniques
  • Physical Sciences › Engineering › Computational Mechanics › Heat Transfer and Numerical Methods
Keywords
leakage power, stochastic solvers, Brownian motion, path decomposition, thermal nonlinearity, integrated circuit thermal management, GPU acceleration

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