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Recent advances in high-k nanocomposite materials for embedded capacitor applications

Jiongxin Lu, Wong, C.·2008·IEEE Transactions on Dielectrics and Electrical Insulation

Abstract

In this paper, a wide variety of high dielectric constant (k) composite materials which have been developed and evaluated for embedded capacitor application are reviewed. Current research efforts toward achieving high dielectric performance including high-k and low dielectric loss for polymer composites are presented. New insights into the effect of unique properties of the nanoparticle filler, filler modification and the dispersion between filler and polymer matrix on the dielectric properties of the nanocomposites are discussed in details.

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Metadata

Authors
Lu, J., & Wong, C.
Venue
IEEE Transactions on Dielectrics and Electrical Insulation
Published
2008-10
Volume
15
Issue
5
Pages
1322-1328
ISSN
1070-9878 (ISSN-L)
OpenAlex
W2116491450
Cited by
170
References
0
FWCI
4.90
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: Recent advances in high-k nanocomposite materials for embedded capacitor applications. https://app.cochat.ai/papers/10.1109/tdei.2008.4656240
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Lu, J., & Wong, C. (2008). Recent advances in high-k nanocomposite materials for embedded capacitor applications. IEEE Transactions on Dielectrics and Electrical Insulation. https://doi.org/10.1109/tdei.2008.4656240

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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.