The DOI matches its Crossref record; 13 of the 13 references it cites were found in a registry or an index.
Impedance criterion for power modules comparison
Abstract
It is well known that power modules must exhibit as low as possible stray inductance. However, the total inductance of a power module is not the only parameter to indicate the electrical quality of the packaging. In this paper, mathematical criteria will be given, which will allow the evaluation of power modules interconnects with regard to several objectives: equal current constraints among the different paralleled dies, power-drive, and even drive-drive interactions.
Overview
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
Citations
Cites
Hoer, C. A., & Love, C. (1965) · Journal of Research of the National Bureau of Standards Section C Engineering and Instrumentation · doi:10.6028/jres.069c.016 · Cited by 341
An experimentally verified IGBT model implemented in the Saber circuit simulator
Hefner, A. R., & Diebolt, D. M. (1994) · IEEE Transactions on Power Electronics · doi:10.1109/63.321038 · Cited by 314
Three-dimensional interconnect analysis using partial element equivalent circuits
Heeb, H., & Ruehli, A. E. (1992) · IEEE Transactions on Circuits and Systems I Fundamental Theory and Applications · doi:10.1109/81.199878 · Cited by 201
Extraction of parasitics within wire-bond IGBT modules
Xing, K., Lee, F. C., & Boroyevich, D. (2002) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec.1998.647735 · Cited by 145
Integrated electrical and thermal analysis of integrated power electronics modules using iSIGHT
Chen, J., Wu, Y., Gence, C., Boroyevich, D., & Bøhn, J. H. (2002) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec.2001.912489 · Cited by 32
Jeannin, P.-O., Schanen, J.-L., & Clavel, E. (2002) · IEEE Transactions on Industry Applications · doi:10.1109/28.980374 · Cited by 24
Self-citationDesign and technology of compact high-power converters
Shenai, K., Neudeck, P. G., & Schwarze, G. E. (2001) · IEEE Aerospace and Electronic Systems Magazine · doi:10.1109/62.911318 · Cited by 19
Low inductance, explosion robust IGBT modules in high power inverter applications
Schnur, L., Debled, G., Dewar, S., & Marous, J. (2002) · IEEE Industry Applications Society Annual Meeting (IAS) · doi:10.1109/ias.1998.730277 · Cited by 17
Optimisation of gate circuit layout to suppress power/drive interaction
Akhbari, M., Piette, N., & Schanen, J. (2002) · IEEE Industry Applications Society Annual Meeting (IAS) · doi:10.1109/ias.1998.730281 · Cited by 17
Self-citationPower integration: electrical analysis of new emerging package
Martín, C., Schanen, J., Clavel, E., & Pasterczyk, R. J. (2003) · HAL · Cited by 16
Self-citation
Research works printed but not linked: 1
- consoli, 1999, effects of the internal layout on the performance of igbt power modules, COPEB 99
Cited by
On Dynamic Effects Influencing IGBT Losses in Soft-Switching Converters
Ranstad, P., & Nee, H. (2010) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2010.2055581 · Cited by 76
Design and Implementation of Integrated Common Mode Capacitors for SiC-JFET Inverters
Robutel, R., Martín, C., Buttay, C., Morel, H., Mattavelli, P., Boroyevich, D., & Meuret, R. (2013) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2013.2279772 · Cited by 64
Wu, R., Smirnova, L., Wang, H., Iannuzzo, F., & Blaabjerg, F. (2015) · 2015 9th International Conference on Power Electronics and ECCE Asia (ICPE-ECCE Asia) · doi:10.1109/icpe.2015.7167881 · Cited by 47
Gate Circuit Layout Optimization of Power Module Regarding Transient Current Imbalance
Martín, C., Guichon, J., Schanen, J., & Pasterczyk, R. J. (2006) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2006.880356 · Cited by 47
Self-citationAnalysis of Electromagnetic Coupling and Current Distribution Inside a Power Module
Martín, C., Schanen, J., Guichon, J., & Pasterczyk, R. J. (2007) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2007.900453 · Cited by 39
Self-citationElectromagnetic Considerations for Designing Double-Sided Power Modules
Mandray, S., Guichon, J., Schanen, J., Guyennet, M. M., & Diénot, J.-M. (2009) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2009.2013558 · Cited by 20
Self-citationResearch and measurement of chip current imbalance in IGBT module with multiple chips in parallel
Kong, L., Zhang, J., Qiu, Z., & Meng, J. (2013) · International Conference on Electrical Machines and Systems (ICEMS) · doi:10.1109/icems.2013.6713304 · Cited by 15
Schanen, J., Guichon, J., Roudet, J., Domenech, C., & Meysenc, L. (2010) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2010.2041083 · Cited by 13
Self-citationA Wiring Implementation Technology to Reduce the Inductance of the Power Module
Nakatsu, K., Miyazaki, H., Saito, R., & Ohnuki, J. (2015) · Journal of The Japan Institute of Electronics Packaging · doi:10.5104/jiep.18.270 · Cited by 9
Labrousse, D., Revol, B., Gautier, C., & Costa, F. (2012) · IEEE Transactions on Electromagnetic Compatibility · doi:10.1109/temc.2012.2219056 · Cited by 8
A comprehensive investigation on the short circuit performance of MW-level IGBT power modules
Wu, R. L., Reigosa, P. D., Iannuzzo, F., Wang, H., & Blaabjerg, F. (2015) · European Conference on Power Electronics and Applications · doi:10.1109/epe.2015.7311761 · Cited by 6
Gate Circuit Layout Optimization of Power Module Regarding Transient Current Imbalance
Martín, C., Guichon, J., Schanen, J., & Pasterczyk, R. J. (2006) · IEEE Power Electronics Specialists Conference (PESC) · doi:10.1109/pesc.2005.1581678 · Cited by 5
Self-citationElectromagnetic Considerations for Designing Double-Sided Power Modules
Mandray, S., Guichon, J., Schanen, J., Mermet, M., & Diénot, J.-M. (2007) · IEEE Industry Applications Society Annual Meeting (IAS) · doi:10.1109/07ias.2007.217 · Cited by 4
Self-citationPhysical Layout of High Current Rectifiers: Modern Methods for an Old Challenge
Schanen, J., Guichon, J., Domenech, C., & Meysenc, L. (2008) · IEEE Industry Applications Society Annual Meeting (IAS) · doi:10.1109/08ias.2008.351 · Cited by 3
Self-citationNomura, K., Takahashi, A., Kojima, T., Yamasaki, S., Yaji, K., Bo, H., & FUJITA, K. (2019) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec.2019.8722107 · Cited by 2
Labrousse, D. (2010) · theses.fr (ABES) · doi:10.70675/2e8f366ez1226z4687zbb95z301e3d1369ed · Cited by 2
Minimizing temporal simulation time to estimate common mode disturbances
Labrousse, D., Revol, B., Gautier, C., & Costa, F. (2011) · European Conference on Power Electronics and Applications
Analysis of impedance and current distributions in parallel IGBT design
Matallana, A., Andreu, J., Garate, J. I., de Alegria, I. M., & Kortabarria, I. (2017) · 2017 IEEE 26th International Symposium on Industrial Electronics (ISIE) · doi:10.1109/isie.2017.8001317 · Cited by 12
Metadata
- Authors
- Schanen, J.-L., Martin, C., Frey, D., & Pasterczyk, R.-J.
- Affiliations
- Centre National de la Recherche Scientifique (FR)
- Venue
- IEEE Transactions on Power Electronics
- Published
- 2006-01
- Volume
- 21
- Issue
- 1
- Pages
- 18-26
- ISSN
- 0885-8993 (ISSN-L)
- OpenAlex
- W2136923874
- Cited by
- 18
- References
- 13
- Citations by year
- 2019: 1 · 2017: 1 · 2015: 3 · 2013: 2 · 2012: 1
- FWCI
- 1.97
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- IEEE Transactions on Power Electronics (publishedVersion)
- HAL (submittedVersion)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electromagnetic Compatibility and Noise Suppression
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced DC-DC Converters
- Keywords
- power modules, parasitic inductance, module packaging, interconnects, current sharing, power drive, power electronics packaging
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
