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Cited by 49Photonic and Optical DevicesSemiconductor Lasers and Optical DevicesAdvanced Photonic Communication Systems

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Hybrid 14nm FinFET - Silicon Photonics Technology for Low-Power Tb/s/mm 2 Optical I/O

Rakowski, M., Ban, Y., De Heyn, P., Pantano, N., Snyder, B., Balakrishnan, S., Van Huylenbroeck, S., Bogaerts, L., Demeurisse, C., Inoue, F., Rebibis, K. J., Nolmans, P., Sun, X., Bex, P., Srinivasan, A., De Coster, J., Lardenois, S., Miller, A., Absil, P., Verheyen, P., Velenis, D., Pantouvaki, M., Van Campenhout, J.·2018·2018 IEEE Symposium on VLSI Technology
DOI 10.1109/vlsit.2018.8510668
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Abstract

We demonstrate a microbump flip-chip integrated 14nm-FinFET CMOS-Silicon Photonics (SiPh) technology platform enabling ultra-low power Optical I/O transceivers with 1.6Tb/s/mm2bandwidth density. The transmitter combines a differential FinFET driver with a Si ring modulator, enabling 40Gb/s NRZ optical modulation at 154fJ/bit dynamic power consumption in a 0.015mm2footprint. The receiver combines a FinFET trans-impedance amplifier (TIA) with a Ge photodiode, enabling 40Gb/s NRZ photodetection with -10.3dBm sensitivity at 75fJ/bit power consumption, in a 0.01mm2footprint. High-quality data transmission and reception is demonstrated in a loop-back experiment at 1330nm wavelength over standard single mode fiber (SMF) with 2dB link margin. Finally, a 4×40Gb/s, 0.1mm2wavelength-division multiplexing (WDM) transmitter with integrated thermal control is demonstrated, enabling Optical I/O scaling substantially beyond 100Gb/s per fiber.

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  • Multiple EIC chips can also be flip-chipped, such as a SiGe or scaled-CMOS chip for high-swing drivers and an advanced FinFET chip for DSP/ADC/DAC.

    “Multiple EIC chips can also be flip-chipped, such as (1) a SiGe chip or scaled-CMOS chip with a reasonably large breakdown voltage to permit high-swing drivers and a reasonable switching speed to support the RF speed requirements, and (2) an advanced FinFET chip for DSP/ADC/DAC138.”

    From Roadmapping the next generation of silicon photonics (2024) · cites this paper as [138]

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References 8 · Cited by 49

Research works printed but not linked: 7

  1. 10.1364/OFC.2015.Th5B.8 · DOI
  2. sun, 2015, Single-chip microprocessor that communicates directly using light, Nature, 528, 534, 10.1038/nature16454 · DOI
  3. 10.1109/JSSC.2012.2197234 · DOI
  4. rakowski, 2015, 22.5 A 4×20Gb/s WDM ring-based hybrid CMOS silicon photonics transceiver, ISSCC, 1
  5. 10.1109/JSSC.2012.2189835 · DOI
  6. 10.1109/JLT.2016.2604839 · DOI
  7. 10.1109/JSSC.2009.2034444 · DOI

Metadata

Authors
Rakowski, M., Ban, Y., De Heyn, P., Pantano, N., Snyder, B., Balakrishnan, S., Van Huylenbroeck, S., Bogaerts, L., Demeurisse, C., Inoue, F., Rebibis, K. J., Nolmans, P., Sun, X., Bex, P., Srinivasan, A., De Coster, J., Lardenois, S., Miller, A., Absil, P., Verheyen, P., Velenis, D., Pantouvaki, M., & Van Campenhout, J.
Affiliations
  • IMEC (BE)
  • imec, Leuven, 3001, Belgium
ORCID
Venue
2018 IEEE Symposium on VLSI Technology
Publisher
IEEE
Published
2018-06
Pages
221-222
DOI
10.1109/vlsit.2018.8510668
OpenAlex
W2899239574
Cited by
49
References
8
Citations by year
2026: 4 · 2025: 11 · 2024: 12 · 2023: 6 · 2022: 6 · 2021: 2 · 2020: 4 · 2019: 3 · 2018: 1
FWCI
3.99
Type
conference paper
Language
en
Open access
closed
Licence
Locations
Symposium on VLSI Technology (publishedVersion)
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Photonic and Optical Devices
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor Lasers and Optical Devices
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced Photonic Communication Systems
Keywords
FinFET, silicon photonics, transimpedance amplifier, germanium photodiodes, low-power optical receiver, wavelength division multiplexing, thermal management, 14nm CMOS

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