The DOI matches its Crossref record; 8 of the 8 references it cites were found in a registry or an index.
Monolithic 3D Integrated Circuits
Abstract
3D IC's promise to solve the 2D communication bottleneck, and enable the integration of heterogeneous materials, devices and systems. There are at least three approaches to realize 3D IC's : chip stacking, wafer stacking and full monolithic integration. Each approach is at a different level of maturity and offers various degree of improvement. This paper will focus on the monolithic 3D approach, which offers a high density of device-dimension vertical interconnects and thereby facilitates the optimal assembly of transistors and interconnects in a 3D volume. The performance advantages of such a technology are demonstrated with a 3D-FPGA. Technology challenges of monolithic approach are discussed.
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In the citing paper
“A variety of cell lines showed reduced proliferation rate in 3D cultures compared to those cultured in 2D. 17,27-31”
From Three-dimensional cell culture systems and their applications in drug discovery and cell-based biosensors (2014) · cites this paper as [30]
In the citing paper
“The proliferation rates of cells cultured in 3D and 2D are usually different, and are cell line and matrix dependent.”
From Three-dimensional cell culture systems and their applications in drug discovery and cell-based biosensors (2014) · cites this paper as [30]
In the citing paper
“Most studies have shown that the cell viability in 3D cultures during the first few days (1-5 days) was not significantly different when compared to that in 2D culture. 30,34”
From Three-dimensional cell culture systems and their applications in drug discovery and cell-based biosensors (2014) · cites this paper as [30]
Citations
Cites
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The Stratix II logic and routing architecture
Lewis, D. M., Ahmed, E., Baeckler, G., Betz, V., Bourgeault, M., Cashman, D., Galloway, D. R., Hutton, M., Lane, C., Lee, A., et al. (2005) · ACM/SIGDA International Symposium on Field-Programmable Gate Arrays (FPGA) · doi:10.1145/1046192.1046195 · Cited by 219
Performance Benefits of Monolithically Stacked 3-D FPGA
Lin, M., Gamal, A. E., Lu, Y.-C., et al. (2007) · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · doi:10.1109/tcad.2006.887920 · Cited by 148
Performance benefits of monolithically stacked 3D-FPGA
Lin, M., Gamal, A. E., Lu, Y.-C., et al. (2006) · ACM/SIGDA International Symposium on Field-Programmable Gate Arrays (FPGA) · doi:10.1145/1117201.1117219 · Cited by 98
Resistive Switching Mechanism in $\hbox{Zn}_{x}\hbox{Cd}_{1 - x}\hbox{S}$ Nonvolatile Memory Devices
Wang, Z., Griffin, P. B., McVittie, J. P., Wong, S. S., McIntyre, P. C., & Nishi, Y. (2007) · IEEE Electron Device Letters · doi:10.1109/led.2006.887640 · Cited by 93
Self-citationIntegration of Germanium-on-Insulator and Silicon MOSFETs on a Silicon Substrate
Feng, J. Y., Liu, Y., Griffin, P. B., et al. (2006) · IEEE Electron Device Letters · doi:10.1109/led.2006.883286 · Cited by 67
Self-citationWang, W., Gibby, A., Wang, Z., et al. (2006) · Technical digest - International Electron Devices Meeting/Technical digest · doi:10.1109/iedm.2006.346730 · Cited by 66
Nano-graphoepitaxy of semiconductors for 3D integration
Crnogorac, F., Witte, D. J., Xia, Q., et al. (2007) · Microelectronic Engineering · doi:10.1016/j.mee.2007.01.067 · Cited by 10
Cited by
Sorted by citations
Edmondson, R., Broglie, J. J., Adcock, A. F., & Yang, L. (2014) · ASSAY and Drug Development Technologies · doi:10.1089/adt.2014.573 · Cited by 2,515
Metadata
- Authors
- Wong, S., El-Gamal, A., Griffin, P., Nishi, Y., Pease, F., & Plummer, J.
- Affiliations
- Stanford University (US)
- Venue
- 2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)
- Publisher
- IEEE
- Published
- 2007-04
- Pages
- 1-4
- OpenAlex
- W2160007566
- Cited by
- 106
- References
- 8
- Citations by year
- 2026: 5 · 2025: 10 · 2024: 2 · 2023: 7 · 2022: 6 · 2021: 9 · 2020: 8 · 2019: 6 · 2018: 8 · 2017: 3 · 2016: 10 · 2015: 5 · 2014: 8 · 2013: 7 · 2012: 4
- FWCI
- 2.51
- Type
- conference paper
- Language
- en
- Open access
- closed
- Locations
- International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) (publishedVersion)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › 3D IC and TSV technologies
- Physical Sciences › Computer Science › Computer Networks and Communications › Interconnection Networks and Systems
- Physical Sciences › Computer Science › Hardware and Architecture › VLSI and Analog Circuit Testing
- Keywords
- monolithic 3D integration, 3D integrated circuits, vertical interconnects, chip stacking, wafer stacking, 3D FPGA, heterogeneous integration, technology challenges
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