Thermal Conductivity Measurements of Thin Aluminum Layers Using Steady State Joule Heating and Electrical Resistance Thermometry in Suspended Bridges
Abstract
Thin metallic film layers are extensively used as the constituents of the micro-devices. The reliability of these devices, therefore, strongly depends on the thermal behavior of such film layers. Aluminum thin film layers are of particular interest in this respect. The lateral thermal conductivity of the aluminum film layers is measured, using the steady state electrical Joule heating and electrical resistance thermometry technique. Aluminum suspended microbridges of identical thicknesses (500 nm) and variable widths (16 to 18 μm) and/or lengths (200 to 500 μm) are fabricated, using conventional microfabrication processes. The lateral thermal conductivity of the 500 nm thick Aluminum film layer was found to be k = 174 ± 13 Wm−1 K−1, at room temperature (300 K).
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Electrical resistance thermometry has been applied to measure the thermal conductivity of low-dimensional solids in both direct and modulated current configurations.
“Electrical resistance thermometry has been applied to measure the thermal conductivity of low dimensional solids (films, membranes, wires, and bridges) [13-15] in both direct [16-20] and modulated (1-omega, 2-omega, 3-omega) [21,22] current configurations.”
From Mean Free Path Effects on the Experimentally Measured Thermal Conductivity of Single-Crystal Silicon Microbridges (2013) · cites this paper as [17]
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English, T. S., Phinney, L. M., Hopkins, P. E., & Serrano, J. R. (2013) · Journal of Heat Transfer · doi:10.1115/1.4024357 · Cited by 14 · see citing works
- Authors
- Reifenberg, J., England Voss, R., Rao, P., Schmitt, W., Yang, Y., Shojaei-Zadeh, S., Liu, W., Sadeghipour, S. M., & Asheghi, M.
- Affiliations
- Carnegie Mellon University (US)
- Carnegie Mellon University, Pittsburgh, PA
- Venue
- Heat Transfer, Volume 1
- Publisher
- ASMEDC
- Published
- 2003-01-01
- Pages
- 377-380
- OpenAlex
- W2023122083
- Cited by
- 6
- References
- 0
- Citations by year
- 2013: 1 · 2012: 2
- FWCI
- 4.37
- Type
- conference paper
- Language
- en
- Open access
- closed
- Topics
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced MEMS and NEMS Technologies
- Physical Sciences › Engineering › Computational Mechanics › Heat Transfer and Numerical Methods
- Keywords
- thermal conductivity, aluminum thin films, Joule heating, microfabrication, microdevices, thermal reliability
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