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Isolator-free integration of a temperature-tuned III-V distributed feedback laser in a silicon photonic package using photonic wire bonding
Abstract
We present a fully assembled, low-cost, hybrid-integrated distributed feedback (DFB) III-V laser bonded in an on-chip trench of a silicon photonic integrated circuit (PIC). The laser is coupled to the PIC via photonic wire bonds (PWBs), which provide a low-reflection interface to the PIC, enabling robust, isolator-free single-mode operation over a wide temperature range (up to 70°C, verified by thermal imaging). Through thermal tuning, we achieved continuous single-mode tuning of the operating wavelength up to 4.3 nm (determined to be a tuning efficiency of ∼0.1 nm/°C). We pave the way for densely integrated hybrid DFB-PIC laser packages.
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Metadata
- Authors
- Deenadayalan, V., Nelson, G., Bickford, J., Kemal, J., & Preble, S.
- Venue
- Journal of Optical Microsystems
- Publisher
- SPIE-Intl Soc Optical Eng
- Published
- 2026-02-18
- Volume
- 6
- Issue
- 02
- Pages
- 1-10
- ISSN
- 2708-5260
- Cited by
- 0
- Funders
- Office of Naval Research
- Air Force Research Laboratory under AIM Photonics (FA8650-21-2-1000)
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- CoChat. (2026). Citation check: Isolator-free integration of a temperature-tuned III-V distributed feedback laser in a silicon photonic package using photonic wire bonding. https://app.cochat.ai/papers/10.1117/1.jom.6.2.021002
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- Deenadayalan, V., Nelson, G., Bickford, J., Kemal, J., & Preble, S. (2026). Isolator-free integration of a temperature-tuned III-V distributed feedback laser in a silicon photonic package using photonic wire bonding. Journal of Optical Microsystems. https://doi.org/10.1117/1.jom.6.2.021002
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