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Yield stress and wall slip phenomena in colloidal silica gels
Abstract
Evidence of wall slip and magnitude of yield stress are examined for colloidal gels consisting of hydrophobic silica, polyether, and lithium salts using geometries with serrated, smooth, hydrophilic and hydrophobic surfaces. Serrated plates, which provide minimal wall slip, are used to compare different methods of measuring yield stress: conventional extrapolation of shear stress in steady shear experiments and dynamic experiments at large strain amplitudes. In the latter, the yield stress is denoted by the maximum in the elastic stress, the product of the elastic modulus and strain (G8g), when plotted as a function of strain amplitude. Although excellent agreement is observed in the yield stress values using both these techniques, the dynamic method seems preferable considering its experimental ease, accuracy, and lack of extrapolation. In the presence of smooth geometries, the silica gels show evidence of wall slip with a concomitant decrease in yield stress. Using underestimation of yield stress as a measure of wall slip, we find slip to be unaffected by changes in the gel modulus obtained through incorporation of additional silica or salts. The use of smooth surfaces compared to serrated surfaces leads to approximately a 60 % reduction in yield stress for all such samples. Finally, control of wall slip is attempted using plates modified to have different surface energies. Hydrophobic plates reduce slip significantly and produce data comparable to those with the serrated plates. In contrast, hydrophilic plates have minimal effect on slip and produce data analogous to those obtained using smooth plates. These results can be explained based on the fact that the particle-lean layer, responsible for slip, remains so with hydrophilic plates as it repels the hydrophobic silica particles in favor of the polar solvent. In contrast, the hydrophobic silica interacts with the hydrophobic plates, thus reducing slip. © 2003 The Society of Rheology.
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Cited by
Weng, W., Beck, J. B., Jamieson, A. M., & Rowan, S. J. (2006) · Journal of the American Chemical Society · doi:10.1021/ja063408q · Cited by 531
Osuji, C. O., Kim, C., & Weitz, D. A. (2008) · Physical Review E · doi:10.1103/physreve.77.060402 · Cited by 106
Negi, A. S., & Osuji, C. O. (2009) · Rheologica Acta · doi:10.1007/s00397-008-0341-9 · Cited by 99
Metadata
- Authors
- Walls, H. J., Caines, S. B., Sanchez, A. M., & Khan, S. A.
- Venue
- Journal of Rheology
- Publisher
- Society of Rheology
- Published
- 2003-07
- Volume
- 47
- Issue
- 4
- Pages
- 847-868
- ISSN
- 0097-0360 (ISSN-L)
- 0148-6055
- 1520-8516
- OpenAlex
- W2075682493
- Cited by
- 345
- References
- 0
- FWCI
- 9.28
- Type
- journal article
- Language
- en
- Open access
- closed
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- Walls, H. J., Caines, S. B., Sanchez, A. M., & Khan, S. A. (2003). Yield stress and wall slip phenomena in colloidal silica gels. Journal of Rheology. https://doi.org/10.1122/1.1574023
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