The DOI matches its Crossref record.
Mechanism of Resist Pattern Collapse during Development Process
Abstract
In this study, the mechanism of resist pattern collapse during the resist development process is investigated. Resist pattern collapse occurs while the rinse liquid is being dried off. This conclusion was reached after observing the resist pattern before and after the rinse-liquid drying process. The resist pattern in the rinse liquid was observed using an atomic force microscope. The source of resist pattern collapse is the surface tension of the rinse liquid. The force increases with decreasing space width between resist patterns. To avoid the resist pattern collapse problem, the use of a low-surface-tension rinse liquid, a rinse liquid with contact angle ∼90° at the resist surface, or a rigid and highly adhesive resist material is effective.
Overview
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Self-check
Percentages, sums and reported differences re-computed from the paper’s own numbers.
The self-check needs the paper’s full text.
Citations
Cited by
Elastocapillary coalescence in wet hair
Bico, J., Roman, B., Moulin, L., & Boudaoud, A. (2004) · Nature · doi:10.1038/432690a · Cited by 462
Evolution of patterning materials towards the Moore’s Law 2.0 Era
Goldfarb, D. L. (2022) · Japanese Journal of Applied Physics · doi:10.35848/1347-4065/ac5534 · Cited by 47
Metadata
- Authors
- Tanaka, T., Mitsuaki Morigami, M. M., & Nobufumi Atoda, N. A.
- Venue
- Japanese Journal of Applied Physics
- Publisher
- IOP Publishing
- Published
- 1993-12-01
- Volume
- 32
- Issue
- 12S
- Pages
- 6059
- ISSN
- 0021-4922 (ISSN-L)
- 1347-4065
- OpenAlex
- W2014880400
- Cited by
- 353
- References
- 0
- FWCI
- 6.91
- Type
- journal article
- Language
- en
- Open access
- closed
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
How to cite
Cite CoChat for the checks on this page, and the paper for its own findings.
- This page
- CoChat. (2026). Citation check: Mechanism of Resist Pattern Collapse during Development Process. https://app.cochat.ai/papers/10.1143/jjap.32.6059
- The paper
- Tanaka, T., Mitsuaki Morigami, M. M., & Nobufumi Atoda, N. A. (1993). Mechanism of Resist Pattern Collapse during Development Process. Japanese Journal of Applied Physics. https://doi.org/10.1143/jjap.32.6059
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
