Adhesive Bonding of InP∕InGaAsP Dies to Processed Silicon-On-Insulator Wafers using DVS-bis-Benzocyclobutene
Open accessAbstract
The process of bonding InP ∕ InGaAsP dies to a processed silicon-on-insulator wafer using sub- 300 nm layers of DVS-bis-benzocyclobutene (BCB) was developed. The planarization properties of these DVS-bis-BCB layers were measured and an optimal prebonding die preparation and polymer precure are presented. Bonding quality and bonding strength are assessed, showing high-quality bonding with sufficient bonding strength to survive postbonding processing.
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Surface topography requirements can be relaxed, and bonding strengthened using an intermediate adhesive, but thermal dissipation, long-term stability, optical power handling, and drift properties need to be studied further.
“Surface topography requirements can be relaxed, and bonding strengthened using an intermediate adhesive57–59 but thermal dissipation, long-term stability, optical power handling, and drift properties need to be studied further60.”
From Roadmapping the next generation of silicon photonics (2024) · cites this paper as [59]
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References 17 · Cited by 133
- Authors
- Roelkens, G., Brouckaert, J., Van Thourhout, D., Baets, R., Nötzel, R., & Smit, M.
- Affiliations
- Ghent University (BE)
- Eindhoven University of Technology (NL)
- Venue
- Journal of The Electrochemical Society
- Publisher
- The Electrochemical Society
- Published
- 2006
- Volume
- 153
- Issue
- 12
- Pages
- G1015
- ISSN
- 0013-4651 (ISSN-L)
- OpenAlex
- W2113580656
- Cited by
- 133
- References
- 17
- Citations by year
- 2026: 1 · 2025: 2 · 2024: 4 · 2023: 1 · 2022: 1 · 2021: 4 · 2020: 3 · 2018: 6 · 2017: 4 · 2016: 5 · 2015: 9 · 2014: 13 · 2013: 14 · 2012: 13
- FWCI
- 9.79
- Type
- journal article
- Language
- en
- Open access
- bronze
- doi.org
- Locations
- Journal of The Electrochemical Society (publishedVersion)
- TU/e Research Portal (publishedVersion, other-oa)
- Ghent University Academic Bibliography (Ghent University) (submittedVersion, other-oa)
- TU/e Research Portal (submittedVersion)
- TU/e Research Portal (submittedVersion, other-oa)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › 3D IC and TSV technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor Lasers and Optical Devices
- Keywords
- adhesive bonding, silicon-on-insulator wafers, die attach, planarization, bond strength
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