Line-Profile Analysis Combined with Texture Analysis for Characterizing Dislocation Distribution in Texture Components of Cold-Rolled Copper Sheets
Open accessAbstract
We described a newly developed characterization technique that dislocation density could be individually determined for each texture component of plastically deformed metals by combining the line-profile analysis with the texture analysis by using X-ray diffraction. This method was applied to major texture components of cube, copper, and brass evolved in cold-rolled copper sheets. The Warren–Averbach procedure using two diffraction peaks was used for estimating the dislocation density. An increase in the dislocation density with the rolling reduction was evaluated for individual texture components. Although the individual texture components underwent the different slip paths, the dislocation densities in these texture components were almost comparable; however, the non-texture component was shown to have a higher dislocation density than the texture components. The recovery and recrystallization proceeded preferentially in the non-texture component.
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The Cu sheet in the as-received condition has a Vickers hardness of 135 ± 6 HV, matching typical cold-rolled pure copper at a high deformation level.
“For the Cu sheet, the obtained value (135 ± 6 HV) matches the typical Vickers hardness of a cold-rolled pure copper sheet at a high deformation level [26].”
From Solid-State Diffusion Bonding of Aluminum to Copper for Bimetallic Anode Fabrication (2024) · cites this paper as [26]
The Experimental procedures (Sample; page unavailable) report Vickers hardness measurements on pure copper sheets cold-rolled at reductions up to 85%, with hardness increasing as reduction increased. The cited paper therefore supports the high-deformation comparison, but our copy gives no numerical hardness value to establish that the citing authors’ 135 ± 6 HV matches it. (LLM, conf=0.82)
Experimental — accuracy not yet measuredCopper hardness decreases from 135 to 80 HV after bonding.
“The hardness of AA2024 aluminum sheets decreases from 139 to 100 HV, and copper experiences similar softening, with values dropping from 135 to 80 HV [26].”
From Solid-State Diffusion Bonding of Aluminum to Copper for Bimetallic Anode Fabrication (2024) · cites this paper as [26]
The section on dislocation recovery and recrystallization reports that copper hardness decreased during annealing, so it supports copper softening in a different condition. The Experimental procedures describe rolling and annealing, not bonding, and the text does not give the claimed decrease from 135 to 80 HV. (LLM, conf=0.84)
Experimental — accuracy not yet measuredThe hardness of AA2024 aluminum sheets decreases from 139 to 100 HV after bonding.
“The hardness of AA2024 aluminum sheets decreases from 139 to 100 HV, and copper experiences similar softening, with values dropping from 135 to 80 HV [26].”
From Solid-State Diffusion Bonding of Aluminum to Copper for Bimetallic Anode Fabrication (2024) · cites this paper as [26]
The Experimental procedures section describes tests on pure copper sheets, not AA2024 aluminum. A search for AA2024, bonding, and the 139-to-100 HV change found no passage in our copy addressing the attributed claim; the reported hardness decrease concerns annealed copper instead. No page numbers are available in our copy. (LLM, conf=0.78)
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- A.R. Stokes, Proc. Phys. Soc., 61 (1948) 382-391.
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Solid-State Diffusion Bonding of Aluminum to Copper for Bimetallic Anode Fabrication
de Prado, J., Børresen, B. T., Utrilla, V., & Ureña, A. (2024) · Materials · doi:10.3390/ma17215333 · Cited by 6 · see citing works
- Authors
- Satoh, K., Sato, S., Yamanaka, K., Suzuki, S., Chiba, A., & Wagatsuma, K.
- Affiliations
- Tohoku University (JP)
- Ibaraki University (JP)
- Corresponding author
- Satoh, Kozue
- Venue
- High Temperature Materials and Processes
- Publisher
- Walter de Gruyter GmbH
- Published
- 2016-07-27
- Volume
- 35
- Issue
- 7
- Pages
- 705-713
- ISSN
- 0334-6455 (ISSN-L)
- 2191-0324
- OpenAlex
- W2491036989
- Cited by
- 5
- References
- 0
- Citations by year
- 2024: 2 · 2023: 1 · 2020: 2
- FWCI
- 0.00
- Type
- journal article
- Language
- en
- Open access
- hybrid
- doi.org
- Licence
- Locations
- High Temperature Materials and Processes (publishedVersion, cc-by-nc-nd)
- DOAJ (DOAJ: Directory of Open Access Journals) (submittedVersion, cc-by-sa)
- Funders
- Japan Society for the Promotion of Science (14J07212, 267212)
- Institute for Materials Research, Tohoku University
- Topics
- Physical Sciences › Materials Science › Materials Chemistry › X-ray Diffraction in Crystallography
- Physical Sciences › Materials Science › Materials Chemistry › Microstructure and mechanical properties
- Physical Sciences › Engineering › Mechanics of Materials › Metallurgy and Material Forming
- Keywords
- dislocation density, crystallographic texture, line profile analysis, Warren-Averbach method, cube texture, copper texture, brass texture, recovery, recrystallization, rolling reduction
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