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Low-Temperature Cu-Cu Bonding Using Spark Plasma Sintering System
Open accessAbstract
Diffusion bonding of Cu bars without high vacuum and super-flatening bonding surface was investigated using spark plasma sintering (SPS) system for low-cost Cu-bulk-joint products. Oxygen-free Cu bars were set in graphite jigs, and were moderately compressed due to thermal expansion difference between graphite and Cu. The bonding temperature was measured directly on the Cu bars using a thermocouple. Tensile strength of the Cu-Cu joints increased gradually with increasing bonding time up to 30 min at 350°C and 400°C (respectively, 0.46 and 0.5 Tm, where Tm is Cu melting temperature), and achieved to 25 and 33 MPa, respectively, which were about one order of magnitude lower than the tensile strength of base metals. While, the tensile strength for those bonded at 300°C for 60 min exhibited about 7 MPa. This suggests that the temperature is not enough for removing oxide scale at the Cu-bar surface and/or for enhancing Cu-atom diffusion.
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References 3 · Cited by 7
Research works printed but not linked: 7
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Metadata
- Authors
- Ito, K., Kohama, K., & Saito, T.
- Affiliations
- Joining and Welding Research Institute, The University of Osaka (JP)
- Venue
- QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
- Publisher
- Japan Welding Society
- Published
- 2015
- Volume
- 33
- Issue
- 2
- Pages
- 185s-189s
- ISSN
- 0288-4771 (ISSN-L)
- OpenAlex
- W1863973989
- Cited by
- 7
- References
- 3
- Citations by year
- 2024: 1 · 2023: 2 · 2022: 1 · 2021: 1 · 2020: 1 · 2016: 1
- FWCI
- 0.33
- Type
- journal article
- Language
- en
- Open access
- bronze
- doi.org
- Locations
- QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY (publishedVersion)
- Funders
- Joining and Welding Research Institute, Osaka University
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › 3D IC and TSV technologies
- Keywords
- Cu-Cu bonding, diffusion bonding, spark plasma sintering, low-temperature bonding, oxygen-free copper, tensile strength, oxide scale removal, bonding temperature
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