Effect of Graphene on Interfacial Microstructure and Thermal Conductivity in Copper/Aluminum Composite Plate

Abstract

This study prepared Copper(Cu)/Aluminum(Al) composite materials using hot-rolling technology. The influence of annealing treatment on the interfacial microstructure was systematically investigated, thereby elucidating the correlation between microstructural characteristics and thermal conductivity. The results demonstrated that annealing treatment induced the formation of a continuous intermetallic compound layer at the Cu/Al interface, with its thickness increasing proportionally to elevated temperature and prolonged duration. After spraying graphene onto the aluminum surface via ultrasonic spraying technology, followed by rolling and an annealing treatment, the intermetallic compounds at the Cu/Al interface exhibited a discontinuous distribution pattern. When annealed at 300 °C, the thermal conductivity of the Cu/Al composite plate increased progressively with prolonged duration. For instance, in the absence of graphene, the value increased from 39.288 to 61.827; when graphene was applied via ultrasonic spraying with a spraying distance of 1 mm, the value increased from 49.884 to 73.203, whereas at 400 °C annealing, it exhibited a notable decline as annealing time extended. Graphene at the interface inhibits the diffusion of Cu/Al atoms, reduces the formation of intermetallic compounds, establishes efficient thermal conduction paths, and ultimately enhances the thermal conductivity of the composite material.