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Diffusion Bonding of Al7075 to Ti-6Al-4V by Spark Plasma Sintering and Using a Copper Interlayer
Open accessAbstract
Sheets of aluminum 7075 and titanium Ti-6Al-4V alloys were successfully joined using the spark plasma sintering (SPS) process. A copper foil was placed as an interlayer between the two surfaces. The bonding was made at 480 °C, 500 °C, and 520 °C with a holding time of 10 min and under a uniaxial pressure of 5 MPa and 10 MPa. The obtained bonds were analyzed by scanning electron microscopy, energy dispersive spectroscopy (SEM/EDS), and wavelength dispersive spectroscopy (WDS). It was found that copper diffused away through Al7075 and formed Al2Cu intermetallics but was not present at the joint region. The investigation of the fractured surfaces using X-ray diffraction (XRD) showed that the joint region contained TiAl3, TiAl2, and Ti3Al intermetallic compounds. The presence of the Cu foil was believed to hinder the formation of Al3Ti observed in previous studies by allowing more Ti to diffuse into the Al side.
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References 21 · Cited by 14
Research works printed but not linked: 22
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Metadata
- Authors
- Alhazaa, A., Albrithen, H., Hezam, M., Ali Shar, M., Alhwaimel, I., Alharbi, Y., & Estournes, C.
- Affiliations
- King Saud University (SA)
- Imam Mohammad ibn Saud Islamic University (SA)
- King Abdullah Institute for Nanotechnology, King Saud University, Riyadh 11451, Saudi Arabia
- CIRIMAT, CNRS-INP-UPS, Université Toulouse 3-Paul Sabatier, 118 route de Narbonne, 31062 Toulouse, France
- Corresponding author
- Alhazaa, Abdulaziz
- ORCID
- Venue
- Crystals
- Publisher
- MDPI AG
- Published
- 2022-09-14
- Volume
- 12
- Issue
- 9
- Pages
- 1293
- ISSN
- 2073-4352 (ISSN-L)
- OpenAlex
- W4296930524
- Cited by
- 14
- References
- 21
- Citations by year
- 2026: 8 · 2025: 4 · 2024: 1 · 2023: 1
- FWCI
- 0.57
- Type
- journal article
- Language
- en
- Open access
- gold
- doi.org
- Licence
- Locations
- Crystals (publishedVersion, cc-by)
- HAL (submittedVersion, other-oa)
- DOAJ (DOAJ: Directory of Open Access Journals) (submittedVersion, cc-by-sa)
- Funders
- National Plan for Science, Technology and Innovation (MAARIFAH), King Abdulaziz City for Science and Technology, Kingdom of Saudi Arabia (13-ADV1178-02)
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
- Physical Sciences › Engineering › Mechanical Engineering › Intermetallics and Advanced Alloy Properties
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Keywords
- diffusion bonding, 7075 aluminum alloy, Ti-6Al-4V titanium alloy, dissimilar metal joining, copper interlayer, spark plasma sintering, intermetallic compounds, Al2Cu, TiAl3, Ti3Al, interdiffusion, fractography
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