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Cited by 84Ultrasonics and Acoustic Wave PropagationAcoustic Wave Resonator TechnologiesAdvanced MEMS and NEMS Technologies

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Piezoelectric Micromachined Ultrasonic Transducers (PMUTs): Performance Metrics, Advancements, and Applications

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Birjis, Yumna, Swaminathan, Siddharth, Nazemi, Haleh, Raj, Gian Carlo Antony, Munirathinam, Pavithra, Abu-Libdeh, Aya, Emadi, Arezoo·2022·Sensors
DOI 10.3390/s22239151PMC PMC9738559
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Abstract

With the development of technology, systems gravitate towards increasing in their complexity, miniaturization, and level of automation. Amongst these systems, ultrasonic devices have adhered to this trend of advancement. Ultrasonic systems require transducers to generate and sense ultrasonic signals. These transducers heavily impact the system’s performance. Advancements in microelectromechanical systems have led to the development of micromachined ultrasonic transducers (MUTs), which are utilized in miniaturized ultrasound systems. Piezoelectric micromachined ultrasonic transducers (PMUTs) exhibit higher capacitance and lower electrical impedance, which enhances the transducer’s sensitivity by minimizing the effect of parasitic capacitance and facilitating their integration with low-voltage electronics. PMUTs utilize high-yield batch microfabrication with the use of thin piezoelectric films. The deposition of thin piezoelectric material compatible with complementary metal-oxide semiconductors (CMOS) has opened novel avenues for the development of miniaturized compact systems with the same substrate for application and control electronics. PMUTs offer a wide variety of applications, including medical imaging, fingerprint sensing, range-finding, energy harvesting, and intrabody and underwater communication links. This paper reviews the current research and recent advancements on PMUTs and their applications. This paper investigates in detail the important transduction metrics and critical design parameters for high-performance PMUTs. Piezoelectric materials and microfabrication processes utilized to manufacture PMUTs are discussed. Promising PMUT applications and outlook on future advancements are presented.

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Figure 1 Schematic view of Electric dipole moments in (a) unpolarized piezoelectric material and (b) polarized piezoelectric material in the presence of an electric field.
Figure 1 Schematic view of Electric dipole moments in (a) unpolarized piezoelectric material and (b) polarized piezoelectric material in the presence of an electric field.CC BY · PubMed Central
Figure 2 Schematic side view of a piezoelectric micromachined ultrasonic transducer (PMUT) cell.
Figure 2 Schematic side view of a piezoelectric micromachined ultrasonic transducer (PMUT) cell.CC BY · PubMed Central
Figure 3 (a,b) Three-dimensional perspectives of PMUT cell.
Figure 3 (a,b) Three-dimensional perspectives of PMUT cell.CC BY · PubMed Central
Figure 4 Mass–spring–damper system.
Figure 4 Mass–spring–damper system.CC BY · PubMed Central
Figure 5 PMUT-equivalent circuit model.
Figure 5 PMUT-equivalent circuit model.CC BY · PubMed Central
Figure 6 PMUT fabrication using the back-side etching process. (a) (100) Si wafer as a substrate, (b) Wet oxidation, (c) SiO2 etching using BOE, (d) Boron diffusion, (e) Formation of sacrificial layer by LTO, (f) Oxide etch using BOE, (g) Si etching by EDP, (h) Bottom electrode Ti–Pt deposition by e-beam evaporation, (i) PZT deposition by sol-gel technique, (j) Top electrode TiW–Au deposition by sputtering, (k) Top electrode etching using KI3 and H2, (l) PZT etching using HCl:HF:H2O.
Figure 6 PMUT fabrication using the back-side etching process. (a) (100) Si wafer as a substrate, (b) Wet oxidation, (c) SiO2 etching using BOE, (d) Boron diffusion, (e) Formation of sacrificial layer by LTO, (f) Oxide etch using BOE, (g) Si etching by EDP, (h) Bottom electrode Ti–Pt deposition by e-beam evaporation, (i) PZT deposition by sol-gel technique, (j) Top electrode TiW–Au deposition by sputtering, (k) Top electrode etching using KI3 and H2, (l) PZT etching using HCl:HF:H2O.CC BY · PubMed Central
Figure 7 PMUT fabrication procedure for defining diaphragm via front-side etching technique. (a) RF sputter deposition applies a thick coat of PZT and a Pt electrode top-layer on a silicon wafer layered with SiO2 and Ti/Pt. (b) Reactive ion etching (RIE) exposes the Ti/Pt electrode and patterns the Pt top-layer along with contact lithography. (c) A layer of SiO2 is applied as an insulation pad via sputter deposition and lift-off to prepare for the fabrication of the electrode fan-out. (d) A conformal connection is formed using sputtered and patterned Ti/Pt. (e) Access to the bottom Si layer diaphragm is created by means of an etch via through the Pt, PZT, Ti/Pt, and SiO2 stack. (f) The diaphragm is then laminated with negative photoresist film (MX5015) and coated with parylene to seal the vias.
Figure 7 PMUT fabrication procedure for defining diaphragm via front-side etching technique. (a) RF sputter deposition applies a thick coat of PZT and a Pt electrode top-layer on a silicon wafer layered with SiO2 and Ti/Pt. (b) Reactive ion etching (RIE) exposes the Ti/Pt electrode and patterns the Pt top-layer along with contact lithography. (c) A layer of SiO2 is applied as an insulation pad via sputter deposition and lift-off to prepare for the fabrication of the electrode fan-out. (d) A conformal connection is formed using sputtered and patterned Ti/Pt. (e) Access to the bottom Si layer diaphragm is created by means of an etch via through the Pt, PZT, Ti/Pt, and SiO2 stack. (f) The diaphragm is then laminated with negative photoresist film (MX5015) and coated with parylene to seal the vias.CC BY · PubMed Central
Figure 8 Multiple-electrode PMUT. (a) Top view of four-electrode PMUT, (b) Cross section side view of four-electrode PMUT.
Figure 8 Multiple-electrode PMUT. (a) Top view of four-electrode PMUT, (b) Cross section side view of four-electrode PMUT.CC BY · PubMed Central
Figure 9 (a) Cross-sectional side view of dome-shaped PMUT; (b) 3D view of dome-shaped PMUT.
Figure 9 (a) Cross-sectional side view of dome-shaped PMUT; (b) 3D view of dome-shaped PMUT.CC BY · PubMed Central
Figure 10 (a) PMUT with differential transduction; (b) PMUT with series transduction.
Figure 10 (a) PMUT with differential transduction; (b) PMUT with series transduction.CC BY · PubMed Central
Figure 11 Rectangular PMUT with a large aspect ratio (mode-merging PMUT).
Figure 11 Rectangular PMUT with a large aspect ratio (mode-merging PMUT).CC BY · PubMed Central
Figure 12 Three-dimensional cross-sectional side view of PMUT with backing layer.
Figure 12 Three-dimensional cross-sectional side view of PMUT with backing layer.CC BY · PubMed Central
Figure 13 (a) Three-dimensional cross-sectional view of PMUT with venting rings. (b) Cross-sectional view of PMUT with venting rings with MEMS bond on CMOS.
Figure 13 (a) Three-dimensional cross-sectional view of PMUT with venting rings. (b) Cross-sectional view of PMUT with venting rings with MEMS bond on CMOS.CC BY · PubMed Central
Figure 14 (a) Cross-sectional view of curved PMUT with concave diaphragm. (b) Cross-sectional view of stress engineered self-curved PMUT with concave diaphragm.
Figure 14 (a) Cross-sectional view of curved PMUT with concave diaphragm. (b) Cross-sectional view of stress engineered self-curved PMUT with concave diaphragm.CC BY · PubMed Central
Figure 15 Three-dimensional schematic of a PMUT array based on cavity SOI.
Figure 15 Three-dimensional schematic of a PMUT array based on cavity SOI.CC BY · PubMed Central
Figure 16 (a) Top view of PMUT cells with release holes on the edges, (b) cross-sectional view of fabricated PMUT cells with SOI substrate.
Figure 16 (a) Top view of PMUT cells with release holes on the edges, (b) cross-sectional view of fabricated PMUT cells with SOI substrate.CC BY · PubMed Central
Figure 17 Three-dimensional cross-sectional view of PMUT array illustrating structure details and magnified view of etch holes.
Figure 17 Three-dimensional cross-sectional view of PMUT array illustrating structure details and magnified view of etch holes.CC BY · PubMed Central
Figure 18 Beamforming using sub-array groups of 15 PMUT elements.
Figure 18 Beamforming using sub-array groups of 15 PMUT elements.CC BY · PubMed Central
Figure 19 Schematic view of a PMUT array structure functionalized with a graphene oxide sensing layer.
Figure 19 Schematic view of a PMUT array structure functionalized with a graphene oxide sensing layer.CC BY · PubMed Central
Figure 20 Schematic view of a PDMS-microchannel-integrated structure comprising dual-electrode PMUT elements.
Figure 20 Schematic view of a PDMS-microchannel-integrated structure comprising dual-electrode PMUT elements.CC BY · PubMed Central

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Metadata

Authors
Birjis, Y., Swaminathan, S., Nazemi, H., Raj, G. C. A., Munirathinam, P., Abu-Libdeh, A., & Emadi, A.
Affiliations
University of Windsor (CA)
Corresponding author
Emadi, Arezoo
ORCID
Venue
Sensors
Publisher
MDPI AG
Published
2022-11-25
Volume
22
Issue
23
Pages
9151
ISSN
1424-8220 (ISSN-L)
DOI
10.3390/s22239151
PMC
PMC9738559
OpenAlex
W4310171752
Cited by
84
References
0
Citations by year
2026: 26 · 2025: 31 · 2024: 20 · 2023: 7
FWCI
1.53
Type
journal article
Language
en
Open access
Licence
Locations
  • Sensors (publishedVersion, cc-by)
  • PubMed Central (publishedVersion, cc-by)
  • PubMed (publishedVersion)
  • DOAJ (DOAJ: Directory of Open Access Journals) (submittedVersion, cc-by-sa)
  • Scholarship at UWindsor (University of Windsor) (submittedVersion)
Funders
  • Windsor Cancer Centre Foundation
  • WE-SPARK Health Institute
  • Natural Sciences and Engineering Research Council of Canada (NSERC)
  • CMC Microsystems
  • University of Windsor Office
Topics
  • Physical Sciences › Engineering › Mechanics of Materials › Ultrasonics and Acoustic Wave Propagation
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Acoustic Wave Resonator Technologies
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced MEMS and NEMS Technologies
Keywords
piezoelectric micromachined ultrasonic transducers, microelectromechanical systems, microfabrication, parasitic capacitance, diagnostic imaging, range finding, energy harvesting, intra-body communication, underwater communication
MeSH terms
Equipment Design, Transducers, Ultrasonography, Ultrasonics, Micro-Electrical-Mechanical Systems

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CoChat. (2026). Citation check: Piezoelectric Micromachined Ultrasonic Transducers (PMUTs): Performance Metrics, Advancements, and Applications. https://app.cochat.ai/papers/10.3390/s22239151
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Birjis, Y., Swaminathan, S., Nazemi, H., Raj, G. C. A., Munirathinam, P., Abu-Libdeh, A., & Emadi, A. (2022). Piezoelectric Micromachined Ultrasonic Transducers (PMUTs): Performance Metrics, Advancements, and Applications. Sensors. https://doi.org/10.3390/s22239151